参数资料
型号: DK-114N-1
厂商: Luminus Devices Inc
文件页数: 4/13页
文件大小: 0K
描述: KIT DEV PHLATLIGHT CBT/PT LED
标准包装: 1
系列: PhlatLight®
主要目的: 照明,LED
已用 IC / 零件: CBT,PT 系列
主要属性: 可调光
已供物品: 2 个板,线缆,文档,散热片,硬件
其它名称: 1214-1137
PhlatLight ? DK-114N Series Development Kit Manual
User Instructions
The following procedure explains how to setup the PhlatLight
Evaluation Kit. It is recommended that the table be equipped
with ESD protection.
Important Note: The driver board is capable of providing 14A
of current to any device. Not all PhlatLight products can be
powered at 14A. Care must be taken to ensure the proper cur-
rent is applied to the device. Consult the product data sheets
for current limitations of specific devices.
Equipment Required by User
In order to power and use the development kit, some addition-
al equipment is required. Table 1 lists the type of equipment
as well as a suggested part. An additional list of other compat-
ible power supplies is provided in Appendix B.
Important Note: It is very important that the power supply
feature an isolated output. If the AC input ground is tied to
the DC output ground of the power supply, it will cause dam-
age to the driver board. All of the recommended supplies fea-
ture an isolated output. Please refer to Appendix A for more
information on these requirements.
Figure 6: PhlatLight device and an appropriate thermal in-
terface material
2. Prepare the heat sink surface by dusting or removing any
particulates that have accumulated on the surface. Place
the thermal pad on the heat sink with pre-drilled holes
matching the hole pattern on the core board of the device
(Figures 7 and 8).
Lab Equipment
12V Lab Power Supply
Oscilloscope
Waveform Generator
Recommended Part
Lambda ZUP20-20
Tektronix TDS 3024B
Agilent 33220A
Multimeter
Photodetector
Fluke 187
Thorlabs PDA10A
Figure 7: Prepared heat sink with pre-drilled bolt pattern
Table 1: Additional Lab Equipment
PhlatLight Device Mounting Instructions
The following procedure explains the process to properly
mount a PhlatLight device to the included heat sink using the
included thermal interface material and mounting hardware.
The primary goal is to ensure there is good thermal contact be-
tween the backside of the copper core-board and the front
face of the heat sink.
1. Use a thermal pad of an area slightly larger than the area
of the core-board (Figure 6).
Figure 8: C21 package type thermal interface material
placed on heat sink
3. Place the device on the thermal pad, taking care that the
hole patterns match (Figure 9).
? 2009 Luminus Devices, Inc. - All Rights Reserved
Page 4
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