参数资料
型号: DM330023
厂商: Microchip Technology
文件页数: 40/64页
文件大小: 0K
描述: BOARD DEV DSPICDEM MCHV
产品培训模块: Interleaved Power Factor Correction
标准包装: 1
系列: dsPICDEM™
主要目的: 电源管理,电机控制
嵌入式: 是,其它
已用 IC / 零件: dsPIC33F
主要属性: AC 电感(ACIM)电机,无刷 DC(BLDC)电机,永久磁体同步电机 PMSM)
次要属性: 功率因数修正(PFC)
已供物品:
产品目录页面: 659 (CN2011-ZH PDF)
相关产品: AC300023-ND - DSPIC33F AC INDUCTION MOTOR
MA330018-ND - PIM DSPIC33F MC 44P-100P QFN
MA330017-ND - MODULE DSPIC33 44P-100P QFP MC
MA330014-ND - MODULE DSPIC33 28P-100P QFP MC
MA330013-ND - MODULE PLUG-IN DSPIC33 100TQFP
dsPICDEM? MCHV Development System User’s Guide
Table 4-2, Table 4-3, and Table 4-4 describe the PIM configuration details.
TABLE 4-2:
dsPIC33FJ12MC202 PIM CONFIGURATION DETAILS
dsPIC33FJ12MC202
dsPIC33FJ32MC202
dsPIC33FJ64MC202
PIM Pin
Number
Labels on the
dsPICDEM? MCHV
Development System
Pin
Number
dsPIC33FJ128MC202
dsPIC33FJ32MC302
dsPIC33FJ64MC802
dsPIC33FJ128MC802
Pin Name
PIM Resistor
Configuration
93
94
98
99
100
3
71
18
19
26
27
63
64
25
24
35
41
42
43
70
84
68
PWM1L1
PWM1H1
PWM1L2
PWM1H2
PWM1L3
PWM1H3
PWM2L1
FAULT
PFC_FLT
PGC
PGD
OSI
OSO
IPFC
VACZX_VAC_POT
VBUS
MONITOR_1
MONITOR_2
MONITOR_3
HA/QEA
HB/QEB
HC/INDX
VA
VB
VC
IA
IB
IBUS
VAC
POT
VACZX
RX
TX
USB_RX
USB_TX
BTN
23
22
21
20
19
18
15
14
15
9
8
6
7
27
28
1
2
3
4
70
84
PWM1L/RP15/CN11/RB15
PWM1H1/RP14/CN12/RB14
PWM1L2/RP13/CN13/RB13
PWM1H2/RP12/CN14/RB12
TMS/PWM1L3/RP11/CN15/RB11
TDI/PWM1H3/RP10/CN16/RB10
TDO/PWM2L1/SDA1/RP9/CN21/RB9
TCK/PWM2H1/SCL1/RP8/CN22/RB8
TDO/PWM2L1/SDA1/RP9/CN21/RB9
PGEC3/SOSCO/T1CK/CN0/RA4
PGED3/SOSCI/RP4/CN1/RB4
OSCI/CLKI/CN30/RA2
OSCO/CLKO/CN29/RA3
PGED2/AN0/V REF +/CN2/RA0
PGEC2/AN1/V REF -/CN3/RA1
PGED1/AN2/RP0/CN4/RB0
PGEC1/AN3/RP1/CN5/RB1
AN4/RP2/CN6/RB2
AN5/RP3/CN7/RB3
Not connected
Not connected
Not connected
Not connected
Not connected
Not connected
Not connected
Not connected
Not connected
Not connected
Not connected
Not connected
INT0/RP7/CN23/RB7
ASCL1/RP6/CN24/RB6
Not connected
Not connected
ASDA1/RP5/CN27/RB5
R19
R18
R17
R16
R15
R12
R14, Remove R13
R11
Remove R13
Not applicable
Not applicable
Not applicable
Not applicable
R24, Remove R27
R25, Remove R26
R20, Remove R28
R21, Remove R31
R22, Remove R30
R23, Remove R29
Not applicable
Not applicable
Not applicable
Not applicable
Not applicable
Not applicable
Not applicable
Not applicable
Not applicable
Not applicable
Not applicable
Not applicable
R10, Remove R9
R32, Remove R7 and R8
Not applicable
Not applicable
R6, Remove R5 and R33
DS70605A-page 34
? 2009 Microchip Technology Inc.
相关PDF资料
PDF描述
DMA-MC-XP-N2 IP CORE MCDMA CTLR XPGA ISPXPGA
DN-5002C N-WAY ETHERNET SWITCH 8-PORT
DN-7006GS WIRELESS LAN PCI ADAPTER
DN-7020 WIFI FINDER W/DISPLAY WLAN ADAPT
DN-93501-U/BL CONN JCK RJ45 TOOL FREE CAT5E BK
相关代理商/技术参数
参数描述
DM330023 制造商:Microchip Technology Inc 功能描述:dsPICDEM MCHV Development Board
DM330023-2 功能描述:电源管理IC开发工具 dsPICDE MCHV-2 RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V
DM-330-C 制造商:Greenlee Textron Inc 功能描述:DMM 1000V 10A RMS
DM3312X101R (2500 REEL) 制造商:Laird Technologies Inc 功能描述:IND CHIP BEAD 100OHM 100MHZ 10A - Tape and Reel
DM3312X101R-00 功能描述:FERRITE ULTRA HC 100 OHMS SMT RoHS:否 类别:滤波器 >> 铁氧体磁珠和芯片 系列:- 标准包装:1,000 系列:EMI1812 频率对应阻抗:120 欧姆 @ 100MHz 额定电流:200mA DC 电阻(DCR):最大 400 毫欧 滤波器类型:差模 - 单线 封装/外壳:1812(4532 公制) 安装类型:表面贴装 包装:带卷 (TR) 高度(最大):0.069"(1.75mm) 尺寸/尺寸:0.177" L x 0.126" W(4.50mm x 3.20mm) 其它名称:Q1712807A