参数资料
型号: DS1374U-3+T&R
厂商: Maxim Integrated Products
文件页数: 11/18页
文件大小: 0K
描述: IC RTC I2C W/CHARGER 10-USOP
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 3,000
类型: 二进制计数器
特点: 警报器,方波输出,涓流充电器,监视计时器
时间格式: 二进制
数据格式: 二进制
接口: I²C,2 线串口
电源电压: 2.7 V ~ 3.3 V
电压 - 电源,电池: 1.3 V ~ 3.7 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 10-TFSOP,10-MSOP(0.118",3.00mm 宽)
供应商设备封装: 10-µMAX
包装: 带卷 (TR)
DS1374
I2C, 32-Bit Binary Counter Watchdog RTC with
Trickle Charger and Reset Input/Output
2
_____________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED DC OPERATING CONDITIONS
(VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Voltage Range on VCC Pin Relative to Ground .....-0.3V to +6.0V
Voltage Range on SDA or SCL
Relative to Ground ....................................-0.3V to VCC + 0.3V
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1)
16-Pin SO .....................................................................73°C/W
10-Pin SOP ...............................................................221°C/W
Junction-to-Case Thermal Resistance (
θJC) (Note 1)
16-Pin SO .....................................................................23°C/W
10-Pin SOP .................................................................39°C/W
Operating Temperature Range ...........................-40
°C to +85°C
Storage Temperature Range .............................-55
°C to +125°C
Lead Temperature (soldering, 10s) .................................+260
°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DS1374-33
2.97
3.3
5.50
DS1374-3
2.7
3.0
3.3
Supply Voltage
(Notes 3, 4)
VCC
DS1374-18
1.71
1.8
1.89
V
Input Logic 1
VIH
(Note 3)
0.7 x VCC
VCC + 0.3
V
Input Logic 0
VIL
(Note 3)
-0.3
+0.3 x
VCC
V
Pullup Resistor Voltage (INT,
SQW, SDA, SCL), VCC = 0V
VPU
(Note 3)
5.5
V
DS1374-33
2.70
2.88
2.97
DS1374-3
2.45
2.6
2.7
Power-Fail Voltage
(Note 3)
VPF
DS1374-18
1.51
1.6
1.71
V
DS1374-33
1.3
3.0
VCC
(MAX)
Backup Supply Voltage
(Notes 3, 4, 5)
VBACKUP
DS1374-3, DS1374-18
1.3
3.0
3.7
V
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
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