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参数资料
| 型号： | DS1381 |
| 厂商： | DALLAS SEMICONDUCTOR |
| 元件分类： | DRAM |
| 英文描述： | NV RAMport(非易失性RAM口) |
| 中文描述： | 2K X 8 NON-VOLATILE SRAM, 100 ns, PDIP24 |
| 文件页数： | 4/16页 |
| 文件大小： | 353K |
| 代理商： | DS1381 |
BUF04
WAFER TEST LIMITS
REV. 0
–4–
Parameter
Symbol
Conditions
Limit
Units
Offset Voltage
V
OS
V
OS
I
B
PSRR
V
O
I
SY
A
VCL
V
S
=
±
15 V
V
S
=
±
5 V
V
CM
= 0 V
V =
±
4.5 V to
±
18 V
R
L
= 150
V
O
= 0 V, R
L
= 2 k
V
O
=
±
10 V, R
L
= 2 k
1
2
5
76
±
10.5
8.5
1
±
0.005
mV max
mV max
μ
A max
dB
V min
mA max
V/V
Input Bias Current
Power Supply Rejection Ratio
Output Voltage Range
Supply Current
Gain
NOTE
Electrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard
product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
18 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
18 V
Maximum Power Dissipation . . . . . . . . . . . . . . . See Figure 16
Storage Temperature Range
Z Package . . . . . . . . . . . . . . . . . . . . . . . . . –65
°
C to +175
°
C
P, S Package . . . . . . . . . . . . . . . . . . . . . . . –65
°
C to +150
°
C
Operating Temperature Range
BUF04Z . . . . . . . . . . . . . . . . . . . . . . . . . . –55
°
C to +125
°
C
BUF04S, P . . . . . . . . . . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Junction Temperature Range
Z Package . . . . . . . . . . . . . . . . . . . . . . . . . –65
°
C to +150
°
C
P, S Package . . . . . . . . . . . . . . . . . . . . . . . –65
°
C to +150
°
C
Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300
°
C
Package Type
θ
JA2
θ
JC
Units
8-Pin Cerdip (Z)
8-Pin Plastic DIP (P)
8-Pin SOIC (S)
148
103
158
16
43
43
°
C/W
°
C/W
°
C/W
NOTES
1
Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2
θ
JA
is specified for the worst case conditions, i.e.,
θ
JA
is specified for device in socket
for cerdip, P-DIP, and LCC packages;
θ
JA
is specified for device soldered in circuit
board for SOIC package.
ORDERING GUIDE
Temperature
Range
Package
Description
Package
Option
Model
BUF04AZ/883
BUF04GP
BUF04GS
BUF04GBC
–55
°
C to +125
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
+25
°
C
Cerdip
Plastic DIP
SO
DICE
Q-8
N-8
SO-8
DICE
DICE CHARACTERISTICS
BUF04 Die Size 0.075 x 0.064 inch, 5,280 Sq. Mils
Substrate (Die Backside) Is Connected to V+
Transistor Count 45.
(@ V
S
=
6
15.0 V, T
A
= +25
8
C unless otherwise noted)
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相关代理商/技术参数 |
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|---|---|
| DS1384 | 制造商:DALLAS 制造商全称:Dallas Semiconductor 功能描述:Watchdog Timekeeping Controller |
| DS1384FP | 制造商:MAXIM 制造商全称:Maxim Integrated Products 功能描述:Watchdog Timekeeping Controller |
| DS1384FP-12 | 功能描述:IC CTRLR RTC WDOG 120NS 44-MQFP RoHS:否 类别:集成电路 (IC) >> 时钟/计时 - 实时时钟 系列:- 产品培训模块:Obsolescence Mitigation Program 标准包装:1 系列:- 类型:时钟/日历 特点:警报器，闰年，SRAM 存储容量:- 时间格式:HH:MM:SS（12/24 小时） 数据格式:YY-MM-DD-dd 接口:SPI 电源电压:2 V ~ 5.5 V 电压 - 电源，电池:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WDFN 裸露焊盘 供应商设备封装:8-TDFN EP 包装:管件 |
| DS1384FP-12+ | 功能描述:实时时钟 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS1384FP-120 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Real-Time Clock |
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