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参数资料
| 型号： | DS1646-120+ |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 3/12页 |
| 文件大小： | 0K |
| 描述： | IC RAM TIMEKEEP NV 120NS 32-EDIP |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 12 |
| 类型： | 时钟/日历 |
| 特点： | 闰年，NVSRAM |
| 存储容量： | 128KB |
| 时间格式： | HH:MM:SS（24 小时） |
| 数据格式： | YY-MM-DD-dd |
| 接口： | 并联 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 32-DIP 模块（0.600"，15.24mm） |
| 供应商设备封装： | 32-EDIP |
| 包装： | 管件 |
| 产品目录页面： | 1432 (CN2011-ZH PDF) |
DS1646/DS1646P
11 of 12
NOTES:
1) All voltages are referenced to ground.
2) Typical values are at 25°C and nominal supplies.
3) Outputs are open.
4) Data retention time is at 25°C and is calculated from the date code on the device package. The date
code XXYY is the year followed by the week of the year in which the device was manufactured. For
example, 9225 would mean the 25th week of 1992.
5) tAH1, tDH1 are measured from WE going high.
6) tAH2, tDH2 are measured from CE going high.
7) Real-Time Clock Modules (EDIP) can be successfully processed through conventional wave-
soldering techniques as long as temperatures as long as temperature exposure to the lithium energy
source contained within does not exceed +85°C. Post-solder cleaning with water washing techniques
is acceptable, provided that ultrasonic vibration is not used.
In addition, for the PowerCap version:
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
solder reflow oriented with the label side up (“live-bug”).
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflows and use a solder wick to
remove solder.
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a
different suffix character, but the drawing pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
OUTLINE NO.
LAND
PATTERN NO.
32 EDIP
MDF32+1
—
34 PCAP
PC2+6
—
相关PDF资料 |
PDF描述 |
|---|---|
| DS1647P-120 | IC RAM TIMEKEEP NV 120NS 34-PCM |
| DS1670S | IC CTRLR SYSTEM PORTABLE 20-SOIC |
| DS1672S-3/T&R | IC TIMEKEEPER 3V 32-BIT 8-SOIC |
| DS1673S-3 | IC CTRLR SYSTEM PORT 3V 20-SOIC |
| DS1677E | IC CTRLR SYSTEM PORT 20-TSSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DS1646-120+ | 功能描述:实时时钟 NV Timekeeping RAM RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS1646-15 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:NVRAM (Battery Based) |
| DS1646H-120 | 功能描述:实时时钟 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 总线接口:I2C 日期格式:DW:DM:M:Y 时间格式:HH:MM:SS RTC 存储容量:64 B 电源电压-最大:5.5 V 电源电压-最小:1.8 V 最大工作温度:+ 85 C 最小工作温度: 安装风格:Through Hole 封装 / 箱体:PDIP-8 封装:Tube |
| DS1646L-12 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:NVRAM (Battery Based) |
| DS1646L-120 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:NVRAM (Battery Based) |
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