参数资料
型号: DS3232SN#T&R
厂商: Maxim Integrated Products
文件页数: 12/19页
文件大小: 0K
描述: IC RTC W/TCXO 20-SOIC
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 1,000
类型: 时钟/日历
特点: 警报器,闰年,方波输出,TCXO/晶体
存储容量: 236B
时间格式: HH:MM:SS(12/24 小时)
数据格式: YY-MM-DD-dd
接口: I²C,2 线串口
电源电压: 2.3 V ~ 5.5 V
电压 - 电源,电池: 2.3 V ~ 5.5 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 20-SOIC(0.295",7.50mm 宽)
供应商设备封装: 20-SOIC W
包装: 带卷 (TR)
Extremely Accurate I2C RTC with
Integrated Crystal and SRAM
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
(TA = -40°C to +85°C, unless otherwise noted.) (Notes 2, 3)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Voltage Range on VCC, VBAT, 32kHz, SCL, SDA, RST,
INT/SQW Relative to Ground.............................-0.3V to +6.0V
Junction-to-Ambient Thermal Resistance (
θJC) (Note 1)..55.1°C/W
Junction-to-Case Thermal Resistance (
θJC) (Note 1)..........24°C/W
Operating Temperature Range
(noncondensing) .............................................-40°C to +85°C
Junction Temperature ......................................................+125°C
Storage Temperature Range ...............................-40°C to +85°C
Lead Temperature (soldering, 10s) .................................+260°C
Soldering Temperature (reflow, 2 times max) ....................+260°C
(See the
Handling, PC Board Layout, and Assembly section.)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VCC
2.3
3.3
5.5
Supply Voltage
VBAT
2.3
3.0
5.5
V
Logic 1 Input SDA, SCL
VIH
0.7 x
VCC
VCC +
0.3
V
Logic 0 Input SDA, SCL
VIL
-0.3
+0.3 x
VCC
V
ELECTRICAL CHARACTERISTICS
(VCC = 2.3V to 5.5V, VCC = active supply (see Table 1), TA = -40°C to +85°C, unless otherwise noted.) (Typical values are at VCC =
3.3V, VBAT = 3.0V, and TA = +25°C, unless otherwise noted.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
VCC = 3.3V
200
Active Supply Current
ICCA
32kHz output off
(Notes 4, 5)
VCC = 5.5V
325
A
VCC = 3.3V
120
Standby Supply Current
ICCS
I2C bus inactive, 32kHz
output off, SQW output off
(Note 5)
VCC = 5.5V
160
A
VCC = 3.3V
500
Temperature Conversion Current
ICCSCONV
I2C bus inactive, 32kHz
output off, SQW output off
VCC = 5.5V
600
A
Power-Fail Voltage
VPF
2.45
2.575
2.70
V
ACTIVE SUPPLY (Table 1 ) (2.3V to 5.5V, TA = -40°C to +85°C, unless otherwise noted) (Note 2)
Logic 1 Output, 32kHz
IOH = -1mA
IOH = -0.75mA
IOH = -0.14mA
VOH
Active supply > 3.3V,
3.3V > active supply > 2.7V,
2.7V > active supply > 2.3V
2.0
V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
DS3232
2
Maxim Integrated
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