参数资料
型号: DSPIC30F2020-30I/SP
厂商: Microchip Technology
文件页数: 55/66页
文件大小: 0K
描述: IC DSPIC MCU/DSP 12K 28DIP
产品培训模块: Asynchronous Stimulus
标准包装: 15
系列: dsPIC™ 30F
核心处理器: dsPIC
芯体尺寸: 16-位
速度: 30 MIP
连通性: I²C,IrDA,LIN,SPI,UART/USART
外围设备: 欠压检测/复位,POR,PWM,WDT
输入/输出数: 21
程序存储器容量: 12KB(4K x 24)
程序存储器类型: 闪存
RAM 容量: 512 x 8
电压 - 电源 (Vcc/Vdd): 3 V ~ 5.5 V
数据转换器: A/D 8x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 28-DIP(0.300",7.62mm)
包装: 管件
产品目录页面: 650 (CN2011-ZH PDF)
配用: DM300023-ND - KIT DEMO DSPICDEM SMPS BUCK
DV164005-ND - KIT ICD2 SIMPLE SUIT W/USB CABLE
2010 Microchip Technology Inc.
DS70102K-page 59
dsPIC30F Flash Programming Specification
P9b
TDLY5
Delay between PGD
↓by programming
executive to PGD released by
programming executive
15
μs—
P10
TDLY6
Delay between PGD released by
programming executive to first PGC
↑ of
response
5—
μs—
P11
TDLY7
Delay between clocking out response
words
10
μs—
P12a
TPROG
Row Programming cycle time
1
4
ms
ICSP mode
P12b
TPROG
Row Programming cycle time
0.8
2.6
ms
Enhanced
ICSP mode
P13a
TERA
Bulk/Row Erase cycle time
1
4
ms
ICSP mode
P13b
TERA
Bulk/Row Erase cycle time
0.8
2.6
ms
Enhanced
ICSP mode
TABLE 13-1:
AC/DC CHARACTERISTICS (CONTINUED)
AC/DC CHARACTERISTICS
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25
° C is recommended
Param.
No.
Sym
Characteristic
Min
Max
Units
Conditions
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