参数资料
型号: DSPIC30F6015T-30I/PT
厂商: Microchip Technology
文件页数: 49/66页
文件大小: 0K
描述: IC DSPIC MCU/DSP 144K 64TQFP
产品培训模块: Asynchronous Stimulus
标准包装: 1,200
系列: dsPIC™ 30F
核心处理器: dsPIC
芯体尺寸: 16-位
速度: 30 MIP
连通性: CAN,I²C,SPI,UART/USART
外围设备: 高级欠压探测/复位,LVD,电机控制 PWM,QEI,POR,PWM,WDT
输入/输出数: 52
程序存储器容量: 144KB(48K x 24)
程序存储器类型: 闪存
EEPROM 大小: 4K x 8
RAM 容量: 8K x 8
电压 - 电源 (Vcc/Vdd): 2.5 V ~ 5.5 V
数据转换器: A/D 16x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 64-TQFP
包装: 带卷 (TR)
配用: AC164315-ND - MODULE SKT MPLAB PM3 44TQFP
2010 Microchip Technology Inc.
DS70102K-page 53
dsPIC30F Flash Programming Specification
11.13 Reading the Application ID Word
The application ID word is stored at address 0x8005BE
in executive code memory. To read this memory
location, you must use the SIX control code to move
this program memory location to the VISI register. The
REGOUT control code must then be used to clock the
contents of the VISI register out of the device. The
corresponding control and instruction codes that must
be serially transmitted to the device to perform this
operation are shown in Table 11-13.
Once the programmer has clocked-out the application
ID word, it must be inspected. If the application ID has
the value 0xBB, the programming executive is resident
in memory and the device can be programmed using
the mechanism described in Section 5.0 “Device
Programming”. However, if the application ID has any
other value, the programming executive is not resident
in memory. It must be loaded to memory before the
device can be programmed. The procedure for loading
the programming executive to the memory is described
11.14 Exiting ICSP Mode
After confirming that the programming executive is
resident in memory, or loading the programming
executive, ICSP mode is exited by removing power to
the device or bringing MCLR to VIL. Programming can
then take place by following the procedure outlined in
TABLE 11-13: SERIAL INSTRUCTION EXECUTION FOR READING THE APPLICATION ID WORD
Command
(Binary)
Data
(Hexadecimal)
Description
Step 1: Exit the Reset vector.
0000
040100
000000
GOTO 0x100
NOP
Step 2: Initialize TBLPAG and the read pointer (W0) for TBLRD instruction.
0000
200800
880190
205BE0
207841
000000
BA0890
000000
MOV
#0x80, W0
MOV
W0, TBLPAG
MOV
#0x5BE, W0
MOV
VISI, W1
NOP
TBLRDL [W0], [W1]
NOP
Step 3: Output the VISI register using the REGOUT command.
0001
0000
<VISI>
000000
Clock out contents of the VISI register
NOP
相关PDF资料
PDF描述
PIC16F877T-20I/PT IC MCU FLASH 8KX14 EE 44TQFP
PIC18F4553-I/ML IC PIC MCU FLASH 16KX16 44QFN
PIC18F452-E/ML IC MCU FLASH 16KX16 A/D 44QFN
PIC16C76-04I/SO IC MCU OTP 8KX14 A/D PWM 28SOIC
PIC16LF77-I/PT IC PIC MCU FLASH 8KX14 44TQFP
相关代理商/技术参数
参数描述
DSPIC33EP128GM306-E/MR 功能描述:数字信号处理器和控制器 - DSP, DSC 128KB F 16KB R 12MCP PWM 8/8 IC/OC 2 QEI RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
DSPIC33EP128GM306-H/MR 功能描述:数字信号处理器和控制器 - DSP, DSC 128KB F 16KB R 12MCP PWM 8/8 IC/OC 2 QEI RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
DSPIC33EP128GM306-I/MR 功能描述:数字信号处理器和控制器 - DSP, DSC 128KB F 16KB R 12MCP PWM 8/8 IC/OC 2 QEI RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT
DSPIC33EP128GM310-E/BG 制造商:Microchip Technology Inc 功能描述:128KB FLASH, 16KB RAM, 12 MCPWM, 8/8 IC/OC, 2 QEI, 4 OP-AMPS - Trays 制造商:Microchip Technology Inc 功能描述:IC DSC 121TFBGA 制造商:Microchip Technology Inc 功能描述:128KB 16KB RAM 12 MC 8/8 IC/OC2QEI4OpAmp
DSPIC33EP128GM310-E/PF 制造商:Microchip Technology Inc 功能描述:128KB FLASH, 16KB RAM, 12 MCPWM, 8/8 IC/OC, 2 QEI, 4 OP-AMPS - Trays 制造商:Microchip Technology Inc 功能描述:IC DSC 100TQFP 制造商:Microchip Technology Inc 功能描述:128KB 16KB RAM 12 MC 8/8 IC/OC2QEI4OpAmp