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参数资料
| 型号： | E672-EDGE672 |
| 英文描述： | 500 MHz Pin Electronics Window Comparator and Load |
| 中文描述： | 500兆赫引脚电子窗口比较器和负载 |
| 文件页数： | 2/15页 |
| 文件大小： | 118K |
| 代理商： | E672-EDGE672 |
10
2000 Semtech Corp.
www.semtech.com
EDGE HIGH-PERFORMANCE PRODUCTS
Edge672
PRELIMINARY
Package Information (continued)
3
DETAIL "A"
e / 2
b
0 MIN.
0.08 / 0.20 R.
GAUGE PLANE
0.25
0 – 7
L
C.08
R. MIN.
0.20 MIN.
1.00 REF.
DATUM
PLANE
– H –
A1
0.05
A2
–
S
DETAIL "B"
9
;;;
SS
D
C
ddd
M
A – B
WITH LEAD FINISH
Lead
Cross Section
0.09 / 0.20
0.09 / 0.16
b
1
BASE METAL
2
8 PLACES
11 / 13
A
0.10
/ /
C
M
SEE DETAIL "B"
0.05
ccc
– H –
– C –
SECTION C–C
Notes:
1.
All dimensions and tolerances conform to ANSI Y14.5-1982.
2.
Datum plane -H- located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting
line.
3.
Datums A-B and -D- to be determined at centerline between
leads where leads exit plastic body at datum plane -H-.
4.
To be determined at seating plane -C-.
5.
Dimensions D1 and E1 do not include mold protrusion.
6.
“N” is the total # of terminals.
7.
These dimensions to be determined at the datum plane -H-.
8.
Package top dimensions are smaller than bottom dimensions
and top of package will not overhang bottom of package.
9.
Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08 mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius or the foot.
10.
Controlling dimension: millimeter.
11.
Maximum allowable die thickness to be assembled in this
package family is 0.30 millimeters.
12.
This outline conforms to JEDEC publication 95, registration
MO-136, variations AC, AE, and AF.
C
A
m
y
Sn
i
Mm
o
Nx
a
Me
t
o
N
A0
6
.
1
A5
0
.
00
1
.
05
1
.
0
2
A5
3
.
10
4
.
15
4
.
1
DC
S
B
0
.
94
1
DC
S
B
0
.
78
,
7
EC
S
B
0
.
94
1
EC
S
B
0
.
78
,
7
L5
4
.
00
6
.
05
7
.
0
M5
1
.
0
N2
3
eC
S
B
0
8
.
0
b0
3
.
07
3
.
05
4
.
09
1
b0
3
.
05
3
.
00
4
.
0
c
c0
1
.
0
d
d0
2
.
0
JEDEC VARIATION
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