参数资料
型号: EFM32G200F32
厂商: Energy Micro
文件页数: 57/64页
文件大小: 0K
描述: MCU 32BIT 32KB FLASH 32-QFN
标准包装: 1,000
系列: Gecko
核心处理器: ARM? Cortex?-M3
芯体尺寸: 32-位
速度: 32MHz
连通性: EBI/EMI,I²C,IrDA,智能卡,SPI,UART/USART
外围设备: 欠压检测/复位,DMA,POR,PWM,WDT
输入/输出数: 24
程序存储器容量: 32KB(32K x 8)
程序存储器类型: 闪存
RAM 容量: 8K x 8
电压 - 电源 (Vcc/Vdd): 1.8 V ~ 3.8 V
数据转换器: A/D 4x12b,D/A 1x12b
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 32-VQFN 裸露焊盘
包装: 带卷 (TR)
其它名称: EFM32G200F32-QFN32
...the world's most energy friendly microcontrollers
2013-06-28 - EFM32G200FXX - d0003_Rev1.60
60
www.energymicro.com
Table of Contents
1. Ordering Information .................................................................................................................................. 2
2. System Summary ...................................................................................................................................... 3
2.1. System Introduction ......................................................................................................................... 3
2.2. Configuration Summary .................................................................................................................... 6
2.3. Memory Map ................................................................................................................................. 7
3. Electrical Characteristics ............................................................................................................................. 8
3.1. Test Conditions .............................................................................................................................. 8
3.2. Absolute Maximum Ratings .............................................................................................................. 8
3.3. General Operating Conditions ........................................................................................................... 8
3.4. Current Consumption ..................................................................................................................... 10
3.5. Transition between Energy Modes .................................................................................................... 17
3.6. Power Management ....................................................................................................................... 17
3.7. Flash .......................................................................................................................................... 18
3.8. General Purpose Input Output ......................................................................................................... 19
3.9. Oscillators .................................................................................................................................... 26
3.10. Analog Digital Converter (ADC) ...................................................................................................... 31
3.11. Digital Analog Converter (DAC) ...................................................................................................... 40
3.12. Analog Comparator (ACMP) .......................................................................................................... 42
3.13. Voltage Comparator (VCMP) ......................................................................................................... 44
3.14. Digital Peripherals ....................................................................................................................... 44
4. Pinout and Package ................................................................................................................................. 46
4.1. Pinout ......................................................................................................................................... 46
4.2. Alternate functionality pinout ............................................................................................................ 47
4.3. GPIO pinout overview .................................................................................................................... 49
4.4. QFN32 Package ........................................................................................................................... 50
5. PCB Layout and Soldering ........................................................................................................................ 51
5.1. Recommended PCB Layout ............................................................................................................ 51
5.2. Soldering Information ..................................................................................................................... 53
6. Chip Marking, Revision and Errata .............................................................................................................. 54
6.1. Chip Marking ................................................................................................................................ 54
6.2. Revision ...................................................................................................................................... 54
6.3. Errata ......................................................................................................................................... 54
7. Revision History ...................................................................................................................................... 55
7.1. Revision 1.60 ............................................................................................................................... 55
7.2. Revision 1.50 ............................................................................................................................... 55
7.3. Revision 1.40 ............................................................................................................................... 55
7.4. Revision 1.30 ............................................................................................................................... 55
7.5. Revision 1.20 ............................................................................................................................... 55
7.6. Revision 1.11 ............................................................................................................................... 56
7.7. Revision 1.10 ............................................................................................................................... 56
7.8. Revision 1.00 ............................................................................................................................... 56
7.9. Revision 0.85 ............................................................................................................................... 56
7.10. Revision 0.83 .............................................................................................................................. 57
7.11. Revision 0.82 .............................................................................................................................. 57
7.12. Revision 0.81 .............................................................................................................................. 57
7.13. Revision 0.80 .............................................................................................................................. 57
A. Disclaimer and Trademarks ....................................................................................................................... 58
A.1. Disclaimer ................................................................................................................................... 58
A.2. Trademark Information ................................................................................................................... 58
B. Contact Information ................................................................................................................................. 59
B.1. Energy Micro Corporate Headquarters .............................................................................................. 59
B.2. Global Contacts ............................................................................................................................ 59
相关PDF资料
PDF描述
C8051F562-IM IC 8051 MCU 32K FLASH 32-QFN
VI-B6B-IW-F4 CONVERTER MOD DC/DC 95V 100W
LPC2103FBD48,118 IC ARM7 MCU FLASH 32K 48-LQFP
VI-B6B-IW-F3 CONVERTER MOD DC/DC 95V 100W
VI-B6B-IW-F2 CONVERTER MOD DC/DC 95V 100W
相关代理商/技术参数
参数描述
EFM32G200F32-QFN32 制造商:Energy Micro AS 功能描述:MCU, 32K FLASH, USART+UART 2, QFN32 - Tape and Reel 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 32KB FLASH 32QFN
EFM32G200F32-QFN32T 制造商:Energy Micro AS 功能描述:32 BIT ARM MPU, GECKO - Trays
EFM32G200F32-QFN32-T 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 32KB FLASH 32QFN
EFM32G200F32-T 制造商:Energy Micro AS 功能描述:IC MCU 32BIT 32KB FLASH 32QFN
EFM32G200F64 功能描述:ARM微控制器 - MCU 64KB FLASH 16KB RAM 32MHZ 1.8-3.8V RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT