参数资料
| 型号： | EL1511CS |
| 厂商： | Intersil |
| 文件页数： | 7/18页 |
| 文件大小： | 0K |
| 描述： | IC LINE DRIVER ADSL/VDSL 16-SOIC |
| 标准包装： | 47 |
| 类型： | 驱动器 |
| 驱动器/接收器数： | 1/0 |
| 规程： | DSL |
| 电源电压： | 5 V ~ 15 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 16-SOIC |
| 包装： | 管件 |
15
FN7016.2
April 10, 2007
performance section of the data sheet. When driving a load,
a large portion (about 50%) of the quiescent current
becomes output load current:
where:
PD = 338mW
Assuming a maximum ambient temperature of 85°C and
keeping the junction temperature less than 150°C, the
maximum thermal resistance from junction to ambient
required is:
With proper layout, the EL1511CS package can achieve
47°C/W, well below the thermal resistance required by the
application.
PCB Layout Considerations for Thermal Packages
The EL1511 die is packaged in two different thermal efficient
packages, the 16 Ld SO and 16 Ld QFN packages. The 16
Ld SO package has the same dimensions as standard 0.15"
wide narrow body 16 Ld SO package with a special fused
lead frame that extends out through the center ground pins.
Both packages can use PCB surface metal vias areas and
internal ground planes, to spread heat away from the
package. The larger the PCB area the lower the junction
temperature of the device will be. In XDSL applications,
multiple layer circuit boards with internal ground plane are
generally used. 13 mil vias are recommended to connect the
metal area under the device with the internal ground plane.
Examples of the PCB layouts are shown in the figures below
that result in thermal resistance
θ
JA of 37°C/W for the QFN
package and 47°C/W for the SO package. The thermal
resistance is obtained with the EL1511CL and CS demo
boards. The demo board is a 4-layer board built with 2oz.
copper and has a dimension of 4in2. Note, the user must
follow the thermal layout guideline to achieve these results.
A separate Application Note for the QFN package and layout
recommendations is also available.
PD
12
6.6mA
(
50%
)
12V
(
2
0.705
) 28.2mA
×
–
+
×
=
Θ
JA
150
85
–
338mW
----------------------
192
°C/W
=
-
+
-
+
TXFR
1:2
12.5
RF
464
100
RT
VS-
VS+
VS-
VS+
1.5k
2RG
TX+
TX-
From
AFE
INTERNAL GROUND PLANE (16 Ld SO)
TOP (16 Ld SO)
INTERNAL GROUND PLANE (16 Ld QFN)
TOP (16 Ld QFN)
EL1511
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相关代理商/技术参数 |
参数描述 |
|---|---|
| EL1511CS-T13 | 功能描述:IC LINE DRIVER ADSL/VDSL 16-SOIC RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.295"，7.50mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| EL1511CS-T7 | 功能描述:IC LINE DRIVER ADSL/VDSL 16-SOIC RoHS:否 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.295"，7.50mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| EL1511CSZ | 功能描述:IC LINE DRIVER ADSL/VDSL 16-SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.295"，7.50mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| EL1511CSZ-T13 | 功能描述:IC LINE DRIVER ADSL/VDSL 16-SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.295"，7.50mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
| EL1511CSZ-T7 | 功能描述:IC LINE DRIVER ADSL/VDSL 16-SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 驱动器，接收器，收发器 系列:- 标准包装:1,000 系列:- 类型:收发器 驱动器/接收器数:2/2 规程:RS232 电源电压:3 V ~ 5.5 V 安装类型:表面贴装 封装/外壳:16-SOIC（0.295"，7.50mm 宽） 供应商设备封装:16-SOIC 包装:带卷 (TR) |
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