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| 型号： | EL5824IRE |
| 厂商： | Intersil |
| 文件页数： | 2/11页 |
| 文件大小： | 0K |
| 描述： | IC BUFFER 10XGAMMA 9.5MA 28HTSSO |
| 标准包装： | 50 |
| 应用： | TFT-LCD 面板：伽玛缓冲器，VCOM 驱动器 |
| 输出类型： | 满摆幅 |
| 电路数： | 10 |
| -3db带宽： | 12MHz |
| 转换速率： | 15 V/µs |
| 电流 - 电源： | 9.5mA |
| 电流 - 输出 / 通道： | 140mA |
| 电压 - 电源，单路/双路(±)： | 4.5 V ~ 16.5 V，±2.25 V ~ 8.25 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-SOIC（0.173"，4.40mm 宽）裸露焊盘 |
| 供应商设备封装： | 28-TSSOP 裸露焊盘 |
| 包装： | 管件 |
10
will limit the short circuit current to ±200mA if the outputs are
directly shorted to the positive or the negative supply. If the
output is shorted indefinitely, the power dissipation could
easily increase such that the part will be destroyed.
Maximum reliability is maintained if the output continuous
current never exceeds ±30mA for the buffers and ±60mA for
the VCOM amplifier. These limits are set by the design of the
internal metal interconnections.
The Unused Buffers
It is recommended that any unused buffers should have their
inputs tied to ground plane.
Power Dissipation
With the high-output drive capability of the EL5524, EL5624,
EL5724, and EL5824, it is possible to exceed the 125°C
“absolute-maximum junction temperature” under certain load
current conditions. Therefore, it is important to calculate the
maximum junction temperature for the application to
determine if load conditions need to be modified for the
buffer to remain in the safe operating area.
The maximum power dissipation allowed in a package is
determined according to:
where:
TJMAX = Maximum junction temperature
TAMAX = Maximum ambient temperature
θJA = Thermal resistance of the package
PDMAX = Maximum power dissipation in the package
The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the loads, or:
when sourcing, and:
when sinking.
where:
i = 1 to total number of buffers
VS = Total supply voltage of buffer and VCOM
ISMAX = Total quiescent current
VOUTi = Maximum output voltage of the application
VOUT = Maximum output voltage of VCOM
ILOADi = Load current of buffer
ILA = Load current of VCOM
If we set the two PDMAX equations equal to each other, we
can solve for the RLOAD's to avoid device overheat. The
package power dissipation curves provide a convenient way
to see if the device will overheat. The maximum safe power
dissipation can be found graphically, based on the package
type and the ambient temperature. By using the previous
equation, it is a simple matter to see if PDMAX exceeds the
device's power derating curves.
Power Supply Bypassing and Printed Circuit
Board Layout
As with any high frequency device, good printed circuit
board layout is necessary for optimum performance. Ground
plane construction is highly recommended, lead lengths
should be as short as possible, and the power supply pins
must be well bypassed to reduce the risk of oscillation. For
normal single supply operation, where the VS- pin is
connected to ground, one 0.1F ceramic capacitor should be
placed from the VS+ pin to ground. A 4.7F tantalum
capacitor should then be connected from the VS+ pin to
ground. One 4.7F capacitor may be used for multiple
devices. This same capacitor combination should be placed
at each supply pin to ground if split supplies are to be used.
Important Note: The metal plane used for heat sinking of
the device is electrically connected to the negative
supply potential (VS-). If VS- is tied to ground, the
thermal pad can be connected to ground. Otherwise, the
thermal pad must be isolated from any other power
planes.
P
DMAX
T
JMAX - TAMAX
Θ
JA
---------------------------------------------
=
P
DMAX
V
S
I
S
ΣiV
S+
(
[
V
OUTi )
I
LOADi ]
V
S+
(
V
OUT )
I
LA
×
–
+
×
–
×
+
×
=
P
DMAX
V
S
I
S
ΣiV
(
OUTi
[
V
S- )
I
LOAD i ]
V
OUT
(
V
S- )
I
LA
×
–
+
×
–
×
+
×
=
EL5524, EL5624, EL5724, EL5824
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相关代理商/技术参数 |
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|---|---|
| EL5824IRE-T13 | 功能描述:IC BUFFER 10XGAMMA 9.5MA 28HTSSO RoHS:否 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 应用:TFT-LCD 面板：VCOM 驱动器 输出类型:满摆幅 电路数:1 -3db带宽:35MHz 转换速率:40 V/µs 电流 - 电源:3.7mA 电流 - 输出 / 通道:1.3A 电压 - 电源，单路/双路(±):9 V ~ 20 V，±4.5 V ~ 10 V 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 供应商设备封装:8-uMax-EP 包装:管件 |
| EL5824IRE-T7 | 功能描述:IC BUFFER 10XGAMMA 9.5MA 28HTSSO RoHS:否 类别:集成电路 (IC) >> 线性 - 放大器 - 视频放大器和频缓冲器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 应用:TFT-LCD 面板：VCOM 驱动器 输出类型:满摆幅 电路数:1 -3db带宽:35MHz 转换速率:40 V/µs 电流 - 电源:3.7mA 电流 - 输出 / 通道:1.3A 电压 - 电源，单路/双路(±):9 V ~ 20 V，±4.5 V ~ 10 V 安装类型:表面贴装 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽）裸露焊盘 供应商设备封装:8-uMax-EP 包装:管件 |
| EL5824IREZ | 功能描述:运算放大器 - 运放 EL5824IREZ 10 CH GAMMA BUFRS W/VCOM RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| EL5824IREZ-T13 | 功能描述:运算放大器 - 运放 EL5824IREZ 10 CH GAMMA BUFRS W/VCOM RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| EL5824IREZ-T7 | 功能描述:运算放大器 - 运放 EL5824IREZ 10 CH GAMMA BUFRS W/VCOM RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
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