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参数资料
| 型号： | EL7566DRE-EVAL |
| 厂商： | Intersil |
| 文件页数： | 13/14页 |
| 文件大小： | 0K |
| 描述： | DEMO BOARD FOR EL7566 |
| 标准包装： | 1 |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 1.8V |
| 电流 - 输出： | 6A |
| 输入电压： | 3 ~ 6 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 500kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | EL7566 |
EL7566
For convenience, Table 3 lists the compensation values for
frequently used output voltages.
TABLE 3. COMPENSATION VALUES
Layout Considerations
The layout is very important for the converter to function
properly. Follow these tips for best performance:
V O (V)
3.3
2.5
1.8
1.5
1.2
1
0.8
R C (k Ω )
13.7
10.5
7.68
6.49
5.23
4.42
3.57
C C (pF)
8200
8200
8200
8200
8200
8200
8200
1. Separate the Power Ground ( ) and Signal Ground ( );
connect them only at one point right at the SGND pin
2. Place the input capacitor(s) as close to V IN and PGND
pins as possible
3. Make as small as possible the loop from LX pins to L to
C O to PGND pins
4. Place R 1 and R 2 pins as close to the FB pin as possible
5. Maximize the copper area around the PGND pins; do not
place thermal relief around them
6. Thermal pad should be soldered to PCB. Place several
via holes under the chip to the ground plane to help heat
dissipation
Thermal Management
The EL7566 is packaged in a thermally-efficient HTSSOP-28
package, which utilizes the exposed thermal pad at the
bottom to spread heat through PCB metal.
Therefore:
1. The thermal pad must be soldered to the PCB.
2. Maximize the PCB area.
3. If a multiple layer PCB is used, thermal vias (13 to 25 mil)
must be placed underneath the thermal pad to connect to
ground plane(s). Do not place thermal reliefs on the vias.
Figure 25 shows a typical connection.
The thermal resistance for this package is as low as 26°C/W
for 2 layer PCB of 0.39" thickness (See Figure 9). The actual
junction temperature can be measured at V TJ pin.
The thermal performance of the IC is heavily dependent on
the layout of the PCB. The user should exercise care during
the design phase to ensure the IC will operate within the
recommended environmental conditions.
The demo board is a good example of layout based on this
outline. Please refer to the EL7566 Application Brief.
COMPONENT SIDE
CONNECTION
GROUND PLANE
CONNECTION
FIGURE 25. PCB LAYOUT - 28-PIN HTSSOP PACKAGE
13
FN7102.7
May 8, 2006
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相关代理商/技术参数 |
参数描述 |
|---|---|
| EL7566DRE-T13 | 功能描述:IC REG BUCK SYNC ADJ 6A 28HTSSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:降压（降压） 输出类型:固定 输出数:1 输出电压:3.3V 输入电压:4.5 V ~ 24 V PWM 型:- 频率 - 开关:- 电流 - 输出:125mA 同步整流器:无 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 包装:Digi-Reel® 供应商设备封装:SOT-6 其它名称:MAX1836EUT33#TG16DKR |
| EL7566DRE-T7 | 功能描述:IC REG BUCK SYNC ADJ 6A 28HTSSOP RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 开关稳压器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:降压（降压） 输出类型:固定 输出数:1 输出电压:3.3V 输入电压:4.5 V ~ 24 V PWM 型:- 频率 - 开关:- 电流 - 输出:125mA 同步整流器:无 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-6 包装:Digi-Reel® 供应商设备封装:SOT-6 其它名称:MAX1836EUT33#TG16DKR |
| EL7566DREZ | 功能描述:直流/直流开关调节器 EL7566DREZ 6 AMP DC: DC STP DWNG RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
| EL7566DREZ-T13 | 功能描述:直流/直流开关调节器 EL7566DREZ 6 AMP DC: DC STP DWNG RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
| EL7566DREZ-T7 | 功能描述:直流/直流开关调节器 EL7566DREZ 6 AMP DC: DC STP DWNG RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
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