参数资料
| 型号： | EL9214IREZ-T7 |
| 厂商： | Intersil |
| 文件页数： | 3/11页 |
| 文件大小： | 0K |
| 描述： | IC AMP QUAD 100MHZ 100MA14HTSSOP |
| 标准包装： | 1 |
| 放大器类型： | 电压反馈 |
| 电路数： | 4 |
| 转换速率： | 115 V/µs |
| 增益带宽积： | 63MHz |
| -3db带宽： | 130MHz |
| 电流 - 输入偏压： | 1.4µA |
| 电压 - 输入偏移： | 1000µV |
| 电流 - 电源： | 8.8mA |
| 电流 - 输出 / 通道： | 300mA |
| 电压 - 电源，单路/双路(±)： | 5 V ~ 13.5 V，±2.5 V ~ 6.75 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 14-TSSOP （0.173"，4.40mm 宽）裸露焊盘 |
| 供应商设备封装： | 14-HTSSOP |
| 包装： | 剪切带 (CT) |
| 其它名称： | EL9214IREZ-T7CT |
11
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FN7007.1
August 10, 2007
EL9211, EL9212, EL9214
HMSOP (Heat-Sink MSOP) Package Family
1
(N/2)
(N/2)+1
N
PLANE
SEATING
N LEADS
0.10 C
PIN #1
I.D.
E1
E
b
DETAIL X
3° ±3°
GAUGE
PLANE
SEE DETAIL "X"
c
A
0.25
A2
A1
L
0.25
C A B
D
A
M
B
e
C
0.08
C A B
M
H
L1
END VIEW
SIDE VIEW
TOP VIEW
E2
BOTTOM VIEW
D1
EXPOSED
THERMAL PAD
MDP0050
HMSOP (HEAT-SINK MSOP) PACKAGE FAMILY
SYMBOL
MILLIMETERS
TOLERANCE
NOTES
HMSOP8 HMSOP10
A1.00
1.00
Max.
-
A1
0.075
+0.025/-0.050
-
A2
0.86
±0.09
-
b
0.30
0.20
+0.07/-0.08
-
c0.15
0.15
±0.05
-
D
3.00
±0.10
1, 3
D1
1.85
Reference
-
E4.90
4.90
±0.15
-
E1
3.00
±0.10
2, 3
E2
1.73
Reference
-
e0.65
0.50
Basic
-
L0.55
0.55
±0.15
-
L1
0.95
Basic
-
N
8
10
Reference
-
Rev. 1 2/07
NOTES:
1. Plastic or metal protrusions of 0.15mm maximum per side are not
included.
2. Plastic interlead protrusions of 0.25mm maximum per side are
not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
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