参数资料
型号: EP1K10FC256-2N
厂商: Altera
文件页数: 33/86页
文件大小: 0K
描述: IC ACEX 1K FPGA 10K 256-FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 90
系列: ACEX-1K®
LAB/CLB数: 72
逻辑元件/单元数: 576
RAM 位总计: 12288
输入/输出数: 136
门数: 56000
电源电压: 2.375 V ~ 2.625 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 256-BGA
供应商设备封装: 256-FBGA(17x17)
Altera Corporation
39
ACEX 1K Programmable Logic Device Family Data Sheet
D
e
ve
lo
pm
e
n
t
13
To
o
ls
Notes to tables:
(1)
To implement the ClockLock and ClockBoost circuitry with the Altera software, designers must specify the input
frequency. The Altera software tunes the PLL in the ClockLock and ClockBoost circuitry to this frequency. The
fCLKDEV parameter specifies how much the incoming clock can differ from the specified frequency during device
operation. Simulation does not reflect this parameter.
(2)
Twenty-five thousand parts per million (PPM) equates to 2.5% of input clock period.
(3)
During device configuration, the ClockLock and ClockBoost circuitry is configured before the rest of the device. If
the incoming clock is supplied during configuration, the ClockLock and ClockBoost circuitry locks during
configuration because the tLOCK value is less than the time required for configuration.
(4)
The tJITTER specification is measured under long-term observation. The maximum value for tJITTER is 200 ps if
tINCLKSTB is lower than 50 ps.
I/O
Configuration
This section discusses the PCI pull-up clamping diode option, slew-rate
control, open-drain output option, and MultiVolt I/O interface for
ACEX 1K devices. The PCI pull-up clamping diode, slew-rate control, and
open-drain output options are controlled pin-by-pin via Altera software
logic options. The MultiVolt I/O interface is controlled by connecting
VCCIO to a different voltage than VCCINT. Its effect can be simulated in the
Altera software via the Global Project Device Options dialog box (Assign
menu).
Table 12. ClockLock & ClockBoost Parameters for -2 Speed-Grade Devices
Symbol
Parameter
Condition
Min
Typ
Max
Unit
tR
Input rise time
5ns
tF
Input fall time
5ns
tINDUTY
Input duty cycle
40
60
%
fCLK1
Input clock frequency (ClockBoost clock
multiplication factor equals 1)
25
80
MHz
fCLK2
Input clock frequency (ClockBoost clock
multiplication factor equals 2)
16
40
MHz
fCLKDEV
Input deviation from user specification in
the software (1)
25,000
PPM
tINCLKSTB Input clock stability (measured between
adjacent clocks)
100
ps
tLOCK
Time required for ClockLock or ClockBoost
to acquire lock (3)
10
s
tJITTER
Jitter on ClockLock or ClockBoost-
generated clock (4)
tINCLKSTB < 100
250 (4)
ps
tINCLKSTB < 50
200 (4)
ps
tOUTDUTY Duty cycle for ClockLock or ClockBoost-
generated clock
40
50
60
%
相关PDF资料
PDF描述
A3P125-2FG144I IC FPGA 1KB FLASH 125K 144-FBGA
A3P125-2FGG144I IC FPGA 1KB FLASH 125K 144-FBGA
BR25S320FV-WE2 IC EEPROM SPI 32KB 20MHZ 8-SSOP
EX64-PTQ64I IC FPGA ANTIFUSE 3K 64-TQFP
EX64-PTQG64I IC FPGA ANTIFUSE 3K 64-TQFP
相关代理商/技术参数
参数描述
EP1K10FC256-3 功能描述:FPGA - 现场可编程门阵列 FPGA - ACEX 1K 72 LABs 136 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP1K10FC256-3N 功能描述:FPGA - 现场可编程门阵列 FPGA - ACEX 1K 72 LABs 136 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP1K10FI256-2 功能描述:FPGA - 现场可编程门阵列 FPGA - ACEX 1K 72 LABs 136 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP1K10FI256-2N 功能描述:FPGA - 现场可编程门阵列 FPGA - ACEX 1K 72 LABs 136 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP1K10QC208-1 功能描述:FPGA - 现场可编程门阵列 FPGA - ACEX 1K 72 LABs 120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256