参数资料
型号: EP1K10FC256-3
厂商: Altera
文件页数: 19/86页
文件大小: 0K
描述: IC ACEX 1K FPGA 10K 256-FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 90
系列: ACEX-1K®
LAB/CLB数: 72
逻辑元件/单元数: 576
RAM 位总计: 12288
输入/输出数: 136
门数: 56000
电源电压: 2.375 V ~ 2.625 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 256-BGA
供应商设备封装: 256-FBGA(17x17)
其它名称: 544-1026
26
Altera Corporation
ACEX 1K Programmable Logic Device Family Data Sheet
FastTrack Interconnect Routing Structure
In the ACEX 1K architecture, connections between LEs, EABs, and device
I/O pins are provided by the FastTrack Interconnect routing structure,
which is a series of continuous horizontal and vertical routing channels
that traverse the device. This global routing structure provides
predictable performance, even in complex designs. In contrast, the
segmented routing in FPGAs requires switch matrices to connect a
variable number of routing paths, increasing the delays between logic
resources and reducing performance.
The FastTrack Interconnect routing structure consists of row and column
interconnect channels that span the entire device. Each row of LABs is
served by a dedicated row interconnect. The row interconnect can drive
I/O pins and feed other LABs in the row. The column interconnect routes
signals between rows and can drive I/O pins.
Row channels drive into the LAB or EAB local interconnect. The row
signal is buffered at every LAB or EAB to reduce the effect of fan-out on
delay. A row channel can be driven by an LE or by one of three column
channels. These four signals feed dual 4-to-1 multiplexers that connect to
two specific row channels. These multiplexers, which are connected to
each LE, allow column channels to drive row channels even when all eight
LEs in a LAB drive the row interconnect.
Each column of LABs or EABs is served by a dedicated column
interconnect. The column interconnect that serves the EABs has twice as
many channels as other column interconnects. The column interconnect
can then drive I/O pins or another row’s interconnect to route the signals
to other LABs or EABs in the device. A signal from the column
interconnect, which can be either the output of a LE or an input from an
I/O pin, must be routed to the row interconnect before it can enter a LAB
or EAB. Each row channel that is driven by an IOE or EAB can drive one
specific column channel.
Access to row and column channels can be switched between LEs in
adjacent pairs of LABs. For example, a LE in one LAB can drive the row
and column channels normally driven by a particular LE in the adjacent
LAB in the same row, and vice versa. This flexibility enables routing
resources to be used more efficiently. Figure 13 shows the ACEX 1K LAB.
相关PDF资料
PDF描述
AGL060V2-CS121I IC FPGA 1KB FLASH 60K 121-CSP
ABB66DHFR-S621 EDGECARD 132PS .050 SMD W/O POST
AGL060V2-CSG121I IC FPGA 1KB FLASH 60K 121-CSP
AGLN060V2-VQG100I IC FPGA NANO 1KB 60K 100VQFP
ACB66DHFR-S578 EDGECARD 132POS .050 SMD W/POSTS
相关代理商/技术参数
参数描述
EP1K10FC256-3N 功能描述:FPGA - 现场可编程门阵列 FPGA - ACEX 1K 72 LABs 136 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP1K10FI256-2 功能描述:FPGA - 现场可编程门阵列 FPGA - ACEX 1K 72 LABs 136 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP1K10FI256-2N 功能描述:FPGA - 现场可编程门阵列 FPGA - ACEX 1K 72 LABs 136 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP1K10QC208-1 功能描述:FPGA - 现场可编程门阵列 FPGA - ACEX 1K 72 LABs 120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP1K10QC208-1N 功能描述:FPGA - 现场可编程门阵列 FPGA - ACEX 1K 72 LABs 120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256