参数资料
型号: EP1K10FC256-3
厂商: Altera
文件页数: 23/86页
文件大小: 0K
描述: IC ACEX 1K FPGA 10K 256-FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 90
系列: ACEX-1K®
LAB/CLB数: 72
逻辑元件/单元数: 576
RAM 位总计: 12288
输入/输出数: 136
门数: 56000
电源电压: 2.375 V ~ 2.625 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 256-BGA
供应商设备封装: 256-FBGA(17x17)
其它名称: 544-1026
Altera Corporation
3
ACEX 1K Programmable Logic Device Family Data Sheet
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Software design support and automatic place-and-route provided by
Altera development systems for Windows-based PCs and Sun
SPARCstation, and HP 9000 Series 700/800 workstations
Flexible package options are available in 100 to 484 pins, including
the innovative FineLine BGATM packages (see Tables 2 and 3)
Additional design entry and simulation support provided by EDIF
2 0 0 and 3 0 0 netlist files, library of parameterized modules (LPM),
DesignWare components, Verilog HDL, VHDL, and other interfaces
to popular EDA tools from manufacturers such as Cadence,
Exemplar Logic, Mentor Graphics, OrCAD, Synopsys, Synplicity,
VeriBest, and Viewlogic
Notes:
(1)
ACEX 1K device package types include thin quad flat pack (TQFP), plastic quad flat pack (PQFP), and FineLine
BGA packages.
(2)
Devices in the same package are pin-compatible, although some devices have more I/O pins than others. When
planning device migration, use the I/O pins that are common to all devices.
(3)
This option is supported with a 256-pin FineLine BGA package. By using SameFrameTM pin migration, all FineLine
BGA packages are pin-compatible. For example, a board can be designed to support 256-pin and 484-pin FineLine
BGA packages.
Table 2. ACEX 1K Package Options & I/O Pin Count
Device
100-Pin TQFP
144-Pin TQFP
208-Pin PQFP
256-Pin
FineLine BGA
484-Pin
FineLine BGA
EP1K10
66
92
120
136
136 (3)
EP1K30
102
147
171
171 (3)
EP1K50
102
147
186
249
EP1K100
147
186
333
Table 3. ACEX 1K Package Sizes
Device
100-Pin TQFP
144-Pin TQFP
208-Pin PQFP
256-Pin
FineLine BGA
484-Pin
FineLine BGA
Pitch (mm)
0.50
1.0
Area (mm2)
256
484
936
289
529
Length
× width
(mm
× mm)
16
× 16
22
× 22
30.6
× 30.6
17
× 17
23
× 23
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EP1K10FC256-3N 功能描述:FPGA - 现场可编程门阵列 FPGA - ACEX 1K 72 LABs 136 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP1K10FI256-2 功能描述:FPGA - 现场可编程门阵列 FPGA - ACEX 1K 72 LABs 136 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP1K10FI256-2N 功能描述:FPGA - 现场可编程门阵列 FPGA - ACEX 1K 72 LABs 136 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
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EP1K10QC208-1N 功能描述:FPGA - 现场可编程门阵列 FPGA - ACEX 1K 72 LABs 120 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256