参数资料
型号: EP2AGX260FF35C4
厂商: Altera
文件页数: 84/90页
文件大小: 0K
描述: IC ARRIA II GX 260K 1152FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 3
系列: Arria II GX
LAB/CLB数: 10260
逻辑元件/单元数: 244188
RAM 位总计: 12038144
输入/输出数: 612
电源电压: 0.87 V ~ 0.93 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 1152-BBGA
供应商设备封装: 1152-FBGA(27x27)
Chapter 1: Device Datasheet for Arria II Devices
1–77
Document Revision History
December 2013
Altera Corporation
Document Revision History
Table 1–69 lists the revision history for this chapter.
U,
V
VCM(DC)
DC common mode input voltage.
VICM
Input common mode voltage: The common mode of the differential signal at the receiver.
VID
Input differential voltage swing: The difference in voltage between the positive and
complementary conductors of a differential transmission at the receiver.
VDIF(AC)
AC differential input voltage: Minimum AC input differential voltage required for switching.
VDIF(DC)
DC differential input voltage: Minimum DC input differential voltage required for switching.
VIH
Voltage input high: The minimum positive voltage applied to the input which is accepted by the
device as a logic high.
VIH(AC)
High-level AC input voltage.
VIH(DC)
High-level DC input voltage.
VIL
Voltage input low: The maximum positive voltage applied to the input which is accepted by the
device as a logic low.
VIL(AC)
Low-level AC input voltage.
VIL(DC)
Low-level DC input voltage.
VOCM
Output common mode voltage: The common mode of the differential signal at the transmitter.
VOD
Output differential voltage swing: The difference in voltage between the positive and
complementary conductors of a differential transmission at the transmitter.
W,
X,
Y,
Z
W
High-speed I/O block: The clock boost factor.
Table 1–68. Glossary (Part 4 of 4)
Letter
Subject
Definitions
Table 1–69. Document Revision History (Part 1 of 2)
Date
Version
Changes
December 2013
4.4
July 2012
4.3
Updated the VCCH_GXBL/R operating conditions in Table 1–6.
Finalized Arria II GZ information in Table 1–20.
Added BLVDS specification in Table 1–32 and Table 1–33.
Updated input and output waveforms in Table 1–68.
December 2011
4.2
Updated Table 1–32, Table 1–33, Table 1–34, Table 1–35, Table 1–40, Table 1–41,
Table 1–54, and Table 1–67.
Minor text edits.
June 2011
4.1
Added Table 1–60.
Updated Table 1–32, Table 1–33, Table 1–38, Table 1–41, and Table 1–61.
Updated the “Switching Characteristics” section introduction.
Minor text edits.
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EP2AGX260FF35C4N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 612 IO RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX260FF35C5 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 612 IO RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX260FF35C5N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 612 IO RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX260FF35C6 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 612 IO RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX260FF35C6N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 10260 LABs 612 IO RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256