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参数资料
型号： EP2AGX65DF29C4N
厂商： Altera
文件页数： 84/90页
文件大小： 0K
描述： IC ARRIA II GX FPGA 65K 780FBGA
产品培训模块： Three Reasons to Use FPGA's in Industrial Designs
标准包装： 4
系列： Arria II GX
LAB/CLB数： 2530
逻辑元件/单元数： 60214
RAM 位总计： 5371904
输入/输出数： 364
电源电压： 0.87 V ~ 0.93 V
安装类型： 表面贴装
工作温度： 0°C ~ 85°C
封装/外壳： 780-BBGA
供应商设备封装： 780-FBGA（29x29）
其它名称： 544-2703
Chapter 1: Device Datasheet for Arria II Devices
1–77
Document Revision History
December 2013
Altera Corporation
Arria II Device Handbook Volume 3: Device Datasheet and Addendum
Document Revision History
Table 1–69 lists the revision history for this chapter.
U,
V
VCM(DC)
DC common mode input voltage.
VICM
Input common mode voltage: The common mode of the differential signal at the receiver.
VID
Input differential voltage swing: The difference in voltage between the positive and
complementary conductors of a differential transmission at the receiver.
VDIF(AC)
AC differential input voltage: Minimum AC input differential voltage required for switching.
VDIF(DC)
DC differential input voltage: Minimum DC input differential voltage required for switching.
VIH
Voltage input high: The minimum positive voltage applied to the input which is accepted by the
device as a logic high.
VIH(AC)
High-level AC input voltage.
VIH(DC)
High-level DC input voltage.
VIL
Voltage input low: The maximum positive voltage applied to the input which is accepted by the
device as a logic low.
VIL(AC)
Low-level AC input voltage.
VIL(DC)
Low-level DC input voltage.
VOCM
Output common mode voltage: The common mode of the differential signal at the transmitter.
VOD
Output differential voltage swing: The difference in voltage between the positive and
complementary conductors of a differential transmission at the transmitter.
W,
X,
Y,
Z
W
High-speed I/O block: The clock boost factor.
Table 1–68. Glossary (Part 4 of 4)
Letter
Subject
Definitions
Table 1–69. Document Revision History (Part 1 of 2)
Date
Version
Changes
December 2013
4.4
Updated Table 1–34 and Table 1–35.
July 2012
4.3
■ Updated the VCCH_GXBL/R operating conditions in Table 1–6.
■ Finalized Arria II GZ information in Table 1–20.
■ Added BLVDS specification in Table 1–32 and Table 1–33.
■ Updated input and output waveforms in Table 1–68.
December 2011
4.2
■ Updated Table 1–32, Table 1–33, Table 1–34, Table 1–35, Table 1–40, Table 1–41,
Table 1–54, and Table 1–67.
■ Minor text edits.
June 2011
4.1
■ Added Table 1–60.
■ Updated Table 1–32, Table 1–33, Table 1–38, Table 1–41, and Table 1–61.
■ Updated the “Switching Characteristics” section introduction.
■ Minor text edits.
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EP2AGX65DF29C5 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX65DF29C5N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX65DF29C6 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX65DF29C6N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX65DF29C6NES 制造商:Altera Corporation 功能描述:FPGA Arria
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