收藏本站
参数资料
型号： EP4SGX530NF45C3NES
厂商： Altera
文件页数： 66/82页
文件大小： 0K
描述： IC STRATIX IV GX 530K 1932-FBGA
标准包装： 3
系列： Stratix® IV GX
LAB/CLB数： 21248
逻辑元件/单元数： 531200
RAM 位总计： 28033024
输入/输出数： 904
电源电压： 0.87 V ~ 0.93 V
安装类型： 表面贴装
工作温度： 0°C ~ 85°C
封装/外壳： 1932-BBGA
供应商设备封装： 1932-FBGA（45x45）
Chapter 1: DC and Switching Characteristics for Stratix IV Devices
1–61
Switching Characteristics
March 2014
Altera Corporation
Stratix IV Device Handbook
Volume 4: Device Datasheet and Addendum
Table 1–49 lists the memory output clock jitter specifications for Stratix IV devices.
OCT Calibration Block Specifications
Table 1–50 lists the OCT calibration block specifications for Stratix IV devices.
Table 1–49. Memory Output Clock Jitter Specification for Stratix IV Devices (1), (2), (3), (4)
Parameter
Clock
Network
Symbol
–2/–2X
Speed Grade
–3
Speed Grade
–4
Speed Grade
Unit
Min
Max
Min
Max
Min
Max
Clock period jitter
Regional
t
JIT(per)
-5050-55
55-5555
ps
Cycle-to-cycle period jitter
Regional
t
JIT(cc)
-100
100
-110
110
-110
110
ps
Duty cycle jitter
Regional
t
JIT(duty)
-50
50
-82.5
82.5
-82.5
82.5
ps
Clock period jitter
Global
t
JIT(per)
-75
75
-82.5
82.5
-82.5
82.5
ps
Cycle-to-cycle period jitter
Global
t
JIT(cc)
-150
150
-165
165
-165
165
ps
Duty cycle jitter
Global
t
JIT(duty)
-7575-90
90-9090
ps
Notes to Table 1–49:
(1) The memory output clock jitter measurements are for 200 consecutive clock cycles, as specified in the JEDEC DDR2/DDR3 SDRAM standard.
(2) The clock jitter specification applies to memory output clock pins generated using differential signal-splitter and DDIO circuits clocked by a PLL
output routed on a regional or global clock network as specified. Altera recommends using regional clock networks whenever possible.
(3) The memory output clock jitter stated in Table 1–49 is applicable when an input jitter of 30 ps is applied.
(4) The clock jitter specification is characterized with 70% utilization, 266 MHz core clock frequency, and 12.5% design toggle rate. If your design
exceeds any of these conditions, the jitter specification of the design may not meet the above specification.
Table 1–50. OCT Calibration Block Specifications for Stratix IV Devices
Symbol
Description
Min
Typ
Max
Unit
OCTUSRCLK
Clock required by OCT calibration blocks
—
20
MHz
TOCTCAL
Number of OCTUSRCLK clock cycles required for OCT RS/RT
calibration
—
1000
—
Cycles
TOCTSHIFT
Number of OCTUSRCLK clock cycles required for OCT code
to shift out
—
28
—
Cycles
TRS_RT
Time required between the dyn_term_ctrl and oe signal
transitions in a bidirectional I/O buffer to dynamically switch
between OCT RS and RT
—2.5
—
ns
相关PDF资料
PDF描述
EP7309-CV IC ARM720T MCU 74MHZ 208-LQFP
EP7311-IV-90 IC ARM720T MCU 90MHZ 208-LQFP
EP7312-IV-90 IC ARM720T MCU 90MHZ 208-LQFP
EP9301-CQZ IC ARM9 SOC PROCESSOR 208LQFP
EP9301-IQ IC ARM920T MCU 166MHZ 208-LQFP
相关代理商/技术参数
参数描述
EP4SGX530NF45C4 功能描述:FPGA - 现场可编程门阵列 FPGA - Stratix IV GX 21248 LABs 920 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP4SGX530NF45C4ES 制造商:Altera Corporation 功能描述:IC STRATIX IV GX FPGA 1932FBGA
EP4SGX530NF45C4N 功能描述:FPGA - 现场可编程门阵列 FPGA - Stratix IV GX 21248 LABs 920 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP4SGX530NF45C4NES 制造商:Altera Corporation 功能描述:IC STRATIX IV FPGA 制造商:Altera Corporation 功能描述:IC STRATIX IV GX FPGA 1932FBGA
EP4SGX530NF45I3 功能描述:FPGA - 现场可编程门阵列 FPGA - Stratix IV GX 21248 LABs 920 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*