参数资料
型号: EP7312-CB
厂商: Cirrus Logic Inc
文件页数: 35/54页
文件大小: 0K
描述: IC ARM720T MCU 74MHZ 256-PBGA
标准包装: 90
系列: EP7
核心处理器: ARM7
芯体尺寸: 32-位
速度: 74MHz
连通性: 编解码器,DAI,EBI/EMI,IrDA,键盘,SPI/Microwire1,UART/USART
外围设备: LCD,LED,MaverickKey,PWM
输入/输出数: 27
程序存储器类型: ROMless
RAM 容量: 56K x 8
电压 - 电源 (Vcc/Vdd): 2.3 V ~ 2.7 V
振荡器型: 外部
工作温度: 0°C ~ 70°C
封装/外壳: 256-BGA
包装: 托盘
配用: 598-1209-ND - KIT DEVELOPMENT EP73XX ARM7
其它名称: 598-1232
40
Copyright Cirrus Logic, Inc. 2011
(All Rights Reserved)
DS508F2
EP7312
High-Performance, Low-Power System on Chip
256-Ball PBGA Ball Listing
The list is ordered by ball location.
Table 21. 256-Ball PBGA Ball Listing
Ball Location
Name
Strength
Reset
State
Type
Description
A1
VDDIO
Pad power
Digital I/O power, 3.3 V
A2
nCS[4]
1
High
O
Chip select 4
A3
nCS[1]
1
High
O
Chip select 1
A4
SDCLK
2
Low
O
SDRAM clock out
A5
SDQM[3]
2
Low
O
SDRAM byte lane mask
A6
DD[1]
1
Low
O
LCD serial display data
A7
M
1
Low
O
LCD AC bias drive
A8
VDDIO
Pad power
Digital I/O power, 3.3 V
A9
D[0]
1
Low
I/O
Data I/O
A10
D[2]
1
Low
I/O
Data I/O
A11
A[3]
2
Low
O
System byte address
A12
VDDIO
Pad power
Digital I/O power, 3.3V
A13
A[6]
1
Low
O
System byte address
A14
MOSCOUT
O
Main oscillator out
A15
VDDOSC
Oscillator power
Oscillator power in, 2.5 V
A16
VSSIO
Pad ground
I/O ground
B1
nCS[5]
1
Low
O
Chip select 5
B2
VDDIO
Pad power
Digital I/O power, 3.3 V
B3
nCS[3]
1
High
O
Chip select 3
B4
nMOE/nSDCAS
1
High
O
ROM, expansion OP enable/SDRAM CAS control signal
B5
VDDIO
Pad power
Digital I/O power, 3.3 V
B6
nSDCS[1]
1
High
O
SDRAM chip select 1
B7
DD[2]
1
Low
O
LCD serial display data
B8
CL[1]
1
Low
O
LCD line clock
B9
VDDCORE
Core power
Digital core power, 2.5V
B10
D[1]
1
Low
I/O
Data I/O
B11
A[2]
2
Low
O
System byte address
B12
A[4]
1
Low
O
System byte address
B13
A[5]
1
Low
O
System byte address
B14
WAKEUP
Schmitt
I
System wake up input
B15
VDDIO
Pad power
Digital I/O power, 3.3 V
B16
nURESET
Schmitt
I
User reset input
C1
VDDIO
Pad power
Digital I/O power, 3.3V
C2
EXPCLK
1
I
Expansion clock input
C3
VSSIO
Pad ground
I/O ground
C4
VDDIO
Pad power
Digital I/O power, 3.3 V
C5
VSSIO
Pad ground
I/O ground
C6
VSSIO
Pad ground
I/O ground
C7
VSSIO
Pad ground
I/O ground
C8
VDDIO
Pad power
Digital I/O power, 3.3 V
C9
VSSIO
Pad ground
I/O ground
C10
VSSIO
Pad ground
I/O ground
C11
VSSIO
Pad ground
I/O ground
C12
VDDIO
Pad power
Digital I/O power, 3.3 V
C13
VSSIO
Pad ground
I/O ground
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