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参数资料
| 型号： | EPC16QI100 |
| 厂商： | Altera Corporation |
| 英文描述： | 2. Enhanced Configuration Devices (EPC4, EPC8 & EPC16) Data Sheet |
| 中文描述： | 2。增强型配置器件（EPC4，EPC8 |
| 文件页数： | 13/36页 |
| 文件大小： | 421K |
| 代理商： | EPC16QI100 |
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Altera Corporation
August 2005
2–13
Configuration Handbook, Volume 2
Enhanced Configuration Devices (EPC4, EPC8 & EPC16) Data Sheet
internal interface to the flash. Simultaneous access by the controller and
the external device will cause contention, and result in configuration and
programming failures.
Since the internal flash interface is directly connected to the external flash
interface pins, controller flash access cycles will toggle the external flash
interface pins. The external device must be able to tri-state its flash
interface during these times and ignore transitions on the flash interface
pins.
1
The external flash interface signals cannot be shared between
multiple enhanced configuration devices because this causes
contention during in-system programming and configuration.
During these times, the controller chips inside the enhanced
configuration devices are actively accessing flash memory.
Therefore, enhanced configuration devices do not support
shared flash bus interfaces.
The enhanced configuration device controller chip accesses flash memory
during:
■
■
■
FPGA configuration—reading configuration data from flash
JTAG-based flash programming—storing configuration data in flash
At POR—reading option bits from flash
During these times, the external FPGA/processor must tri-state its
interface to the flash memory. After configuration and programming, the
enhanced configuration device’s controller tri-states the internal interface
and goes into an idle mode. To interrupt a configuration cycle in order to
access the flash via the external flash interface, the external device can
hold the FPGA’s
nCONFIG
input low. This keeps the configuration device
in reset by holding the
nSTATUS
-
OE
line low, allowing external flash
access.
f
For further details on the software support for the external flash interface
feature, refer to
Using Altera Enhanced Configuration Devices
, chapter 3 in
volume 2 of the
Configuration
Handbook
. For details on flash commands,
timing, memory organization, and write protection features, refer to the
appropriate flash data sheet (Sharp LHF16306 for EPC16 devices and
Micron MT28F400B3 for EPC4 devices) on the Altera web site at
www.altera.com
.
Figure 2–4
shows a FPP configuration schematic with the external flash
interface being used.
相关PDF资料 |
PDF描述 |
|---|---|
| EPC8xxx | 2. Enhanced Configuration Devices (EPC4, EPC8 & EPC16) Data Sheet |
| EPC8QC100 | 2. Enhanced Configuration Devices (EPC4, EPC8 & EPC16) Data Sheet |
| EPC8QI100 | 2. Enhanced Configuration Devices (EPC4, EPC8 & EPC16) Data Sheet |
| EPC16xxx | 435882001 |
| EPC4QC100 | 2. Enhanced Configuration Devices (EPC4, EPC8 & EPC16) Data Sheet |
相关代理商/技术参数 |
参数描述 |
|---|---|
| EPC16QI100N | 功能描述:FPGA-配置存储器 IC - Ser. Config Mem Flash 16Mb 33 MHz RoHS:否 制造商:Altera Corporation 存储类型:Flash 存储容量:1.6 Mbit 工作频率:10 MHz 电源电压-最大:5.25 V 电源电压-最小:3 V 电源电流:50 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:PLCC-20 |
| EPC16UC88 | 功能描述:FPGA-配置存储器 IC - Ser. Config Mem Flash 16Mb 33 MHz RoHS:否 制造商:Altera Corporation 存储类型:Flash 存储容量:1.6 Mbit 工作频率:10 MHz 电源电压-最大:5.25 V 电源电压-最小:3 V 电源电流:50 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:PLCC-20 |
| EPC16UC88AA | 功能描述:IC CONFIG DEVICE 16MBIT 88-UBGA RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:EPC 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| EPC16UC88N | 功能描述:FPGA-配置存储器 IC - Ser. Config Mem Flash 16Mb 33 MHz RoHS:否 制造商:Altera Corporation 存储类型:Flash 存储容量:1.6 Mbit 工作频率:10 MHz 电源电压-最大:5.25 V 电源电压-最小:3 V 电源电流:50 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:PLCC-20 |
| EPC16UI88AA | 功能描述:FPGA-配置存储器 IC - Ser. Config Mem Flash 16Mb 33 MHz RoHS:否 制造商:Altera Corporation 存储类型:Flash 存储容量:1.6 Mbit 工作频率:10 MHz 电源电压-最大:5.25 V 电源电压-最小:3 V 电源电流:50 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:PLCC-20 |
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