参数资料
型号: EPF10K100ABC356-2N
厂商: Altera
文件页数: 80/128页
文件大小: 0K
描述: IC FLEX 10KA FPGA 100K 356-BGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 24
系列: FLEX-10K®
LAB/CLB数: 624
逻辑元件/单元数: 4992
RAM 位总计: 24576
输入/输出数: 274
门数: 158000
电源电压: 3 V ~ 3.6 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 356-BGA
供应商设备封装: 356-BGA(35x35)
Altera Corporation
55
FLEX 10K Embedded Programmable Logic Device Family Data Sheet
Figure 23. Output Drive Characteristics for EPF10K250A Device
Timing Model
The continuous, high-performance FastTrack Interconnect routing
resources ensure predictable performance and accurate simulation and
timing analysis. This predictable performance contrasts with that of
FPGAs, which use a segmented connection scheme and therefore have
unpredictable performance.
Device performance can be estimated by following the signal path from a
source, through the interconnect, to the destination. For example, the
registered performance between two LEs on the same row can be
calculated by adding the following parameters:
LE register clock-to-output delay (tCO)
Interconnect delay (tSAMEROW)
LE look-up table delay (tLUT)
LE register setup time (tSU)
The routing delay depends on the placement of the source and destination
LEs. A more complex registered path may involve multiple combinatorial
LEs between the source and destination LEs.
VCCINT = 3.3 V
VCCIO = 3.3 V
Room Temperature
VCCINT = 3.3 V
VCCIO = 2.5 V
Room Temperature
VO Output Voltage (V)
1234
VO Output Voltage (V)
1234
10
20
30
50
40
10
20
30
50
40
IOL
IOH
IOL
IOH
Typical IO
Output
Current (mA)
Typical IO
Output
Current (mA)
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EPF10K100ABC356-3 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 624 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K100ABC356-3N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 624 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K100ABC600-1 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 624 LABs 406 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K100ABC600-2 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 624 LABs 406 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K100ABC600-3 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 624 LABs 406 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256