参数资料
型号: EPF10K30EQC208-2X
厂商: Altera
文件页数: 25/100页
文件大小: 0K
描述: IC FLEX 10KE FPGA 30K 208-PQFP
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 72
系列: FLEX-10KE®
LAB/CLB数: 216
逻辑元件/单元数: 1728
RAM 位总计: 24576
输入/输出数: 147
门数: 119000
电源电压: 2.375 V ~ 2.625 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 208-BFQFP
供应商设备封装: 208-PQFP(28x28)
30
Altera Corporation
FLEX 10KE Embedded Programmable Logic Devices Data Sheet
Figure 14. FLEX 10KE Interconnect Resources
I/O Element
An IOE contains a bidirectional I/O buffer and a register that can be used
either as an input register for external data that requires a fast setup time,
or as an output register for data that requires fast clock-to-output
performance. In some cases, using an LE register for an input register will
result in a faster setup time than using an IOE register. IOEs can be used
as input, output, or bidirectional pins. For bidirectional registered I/O
implementation, the output register should be in the IOE, and the data
input and output enable registers should be LE registers placed adjacent
to the bidirectional pin. The Altera Compiler uses the programmable
inversion option to invert signals from the row and column interconnect
automatically where appropriate. Figure 15 shows the bidirectional I/O
registers.
I/O Element (IOE)
Row
Interconnect
IOE
Column
Interconnect
LAB
B1
See Figure 17
for details.
See Figure 16
for details.
LAB
A3
LAB
B3
LAB
A1
LAB
A2
LAB
B2
IOE
Cascade &
LAB B4
LAB
A4
LAB B5
LAB
A5
IOE
Carry Chains
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EPF10K30EQC208-3DX 制造商:未知厂家 制造商全称:未知厂家 功能描述:ASIC
EPF10K30EQC208-3N 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EPF10K30EQI208-1DX 制造商:未知厂家 制造商全称:未知厂家 功能描述:ASIC
EPF10K30EQI208-2 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 216 LABs 147 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256