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参数资料
| 型号： | EPF10K50V |
| 厂商： | Altera Corporation |
| 英文描述： | Embedded Programmable Logic Family(FLEX10K嵌入式可编程逻辑系列) |
| 中文描述： | 嵌入式可编程逻辑系列（FLEX10K嵌入式可编程逻辑系列） |
| 文件页数： | 4/5页 |
| 文件大小： | 103K |
| 代理商： | EPF10K50V |
4
Altera Corporation
Figure 5. Die Size Comparison
Continuous Routing & Segmented Routing
There are several possible reasons why Altera EPF10K100A devices consume less power than Xilinx
XC4000XL devices. The most significant reason is the device interconnect structure. EPF10K100A devices
use a continuous interconnect routing structure that is better suited for interconnect routing than the pass
transistors used in XC4062XL devices. To demonstrate this difference, model the pass transistors and metal
lines as parallel-plate capacitors. The following equation shows that power is linearly related to capacitance
(C), voltage (V), and voltage switching.
Cvdt
=
Because both devices have similar voltage switching characteristics and operate at a 3.3-V core voltage, the
capacitance will be a major factor in determining which interconnect structure consumes more power.
The equation above shows that for equivalent unit areas (A = 1), the device with the thicker insulator (T)
has less capacitance. The thickness of the XC4062XL pass-gate oxide is about 100 versus about 10,000
for the EPF10K100A metal line. Thus, EPF10K100A devices have less capacitance and consume less
power.
Revision History
The information contained in
Technical Brief 41 (Power Measurements: FLEX 10KA vs. XC4000 Devices)
version 1.01 supersedes information published in
Technical Brief 41 (Power Measurements: FLEX 10KA
vs. XC4000 Devices)
version 1.
Technical Brief 41 (Power Measurements: FLEX 10KA vs. XC4000 Devices)
version 1.01 contains
corrected information on the number of bits per EAB in
“RAM Power Consumption” on page 3
.
Altera EPF10K100A
Relative Die Size = 1
0.35-μm Process
4,992 LEs, 12 EABs
Xilinx XC4062XL
Relative Die Size = 1.9
0.35-μm Process
4,608 LEs, 0 EABs
P
C
T
----
～
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相关代理商/技术参数 |
参数描述 |
|---|---|
| EPF10K50VBC3561 | 制造商:XILINX 功能描述:* |
| EPF10K50VBC356-1 | 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 360 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EPF10K50VBC356-1N | 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 360 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
| EPF10K50VBC3562 | 制造商:ALTERA 功能描述:* |
| EPF10K50VBC356-2 | 功能描述:FPGA - 现场可编程门阵列 FPGA - Flex 10K 360 LABs 274 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256 |
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