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| 型号： | ESD7L5.0DT5G |
| 厂商： | ON Semiconductor |
| 文件页数： | 4/4页 |
| 文件大小： | 0K |
| 描述： | TVS ULT LOW CAP SOT-723 |
| 产品变化通告： | Wire Bond Change 01/Dec/2010 |
| 产品目录绘图： | ESD7C SOD-723 Schematic |
| 标准包装： | 1 |
| 电压 - 反向隔离（标准值）： | 5V |
| 电压 - 击穿： | 5.4V |
| 电极标记： | 2 通道阵列 - 单向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-723 |
| 供应商设备封装： | SOT-723 |
| 包装： | 标准包装 |
| 其它名称： | ESD7L5.0DT5GOSDKR |
ESD7L, SESD7L
PACKAGE DIMENSIONS
SOT ? 723
CASE 631AA
ISSUE C
b1
D
3
1
e
2
? X ?
? Y ?
E
b 2X
0.08 (0.0032) X Y
A
L
C
H E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
A 0.45 0.50 0.55 0.018 0.020 0.022
b 0.15 0.21 0.27 0.0059 0.0083 0.0106
b1 0.25 0.31 0.37 0.010 0.012 0.015
C 0.07 0.12 0.17 0.0028 0.0047 0.0067
SOLDERING FOOTPRINT*
0.40
0.0157
0.40
0.0157
1.0
0.039
0.40
0.0157
0.40
0.40
0.0157
0.0157
D
E
e
H E
L
1.15 1.20 1.25
0.75 0.80 0.85
0.40 BSC
1.15 1.20 1.25
0.15 0.20 0.25
0.045 0.047 0.049
0.03 0.032 0.034
0.016 BSC
0.045 0.047 0.049
0.0059 0.0079 0.0098
SCALE 20:1
mm
inches
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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ESD7L/D
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