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参数资料
| 型号： | EVAL-AD5516-3EBZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 12/16页 |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION AD5516 |
| 产品培训模块： | DAC Architectures |
| 标准包装： | 1 |
| DAC 的数量： | 16 |
| 位数： | 14 |
| 采样率（每秒）： | 750k |
| 数据接口： | 串行 |
| 设置时间： | 32µs |
| DAC 型： | 电压 |
| 工作温度： | -40°C ~ 85°C |
| 已供物品： | 板 |
| 已用 IC / 零件： | AD5516-3 |
| 相关产品： | AD5516ABCZ-3-ND - IC DAC 12BIT 16CH BIPO 74-CSPBGA AD5516ABCZ-2-ND - IC DAC 12BIT VOUT 16CH 74-CSPBGA AD5516ABC-3-ND - IC DAC 12BIT 16CH 74-CSPBGA AD5516ABC-2-ND - IC DAC 12BIT 16CH 74-CSPBGA AD5516ABC-1-ND - IC DAC 12BIT 16CH 74-CSPBGA |
REV. B
AD5516
–5–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD5516 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS
1, 2
(TA = 25
°C, unless otherwise noted.)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +17 V
VSS to AGND . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –17 V
AVCC to AGND, DACGND . . . . . . . . . . . . . . . –0.3 V to +7 V
DVCC to DGND . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +7 V
Digital Inputs to DGND . . . . . . . . . . . –0.3 V to DVCC + 0.3 V
Digital Outputs to DGND . . . . . . . . . . –0.3 V to DVCC + 0.3 V
REF_IN to AGND, DACGND . . . . . . –0.3 V to AVCC + 0.3 V
VOUT0–15 to AGND . . . . . . . . . . . . VSS – 0.3 V to VDD + 0.3 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
RFB0–15 to AGND . . . . . . . . . . . . . VSS – 0.3 V to VDD +0.3 V
Operating Temperature Range, Industrial . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature (TJ MAX) . . . . . . . . . . . . . . . . . . . 150
°C
74-Lead CSPBGA Package, JA Thermal Impedance . . . 41
°C/W
Reflow Soldering
Peak Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
Time at Peak Temperature . . . . . . . . . . . . . 10 sec to 40 sec
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause permanent
damage to the device. This is a stress rating only; functional operation of the device
at these or any other conditions above those listed in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
2Transient currents of up to 100 mA will not cause SCR latch-up.
ORDERING GUIDE
Model
Function
Output Voltage Span
Package Option
AD5516ABC-1
16 DACs
±2.5 V
74-Lead CSPBGA
AD5516ABC-2
16 DACs
±5 V
74-Lead CSPBGA
AD5516ABC-3
16 DACs
±10 V
74-Lead CSPBGA
EVAL-AD5516-1EB
Evaluation Board
EVAL-AD5516-2EB
Evaluation Board
EVAL-AD5516-3EB
Evaluation Board
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