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参数资料
| 型号： | EVAL-ADCMP553BRMZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 12/16页 |
| 文件大小： | 0K |
| 描述： | BOARD EVALUATION ADCMP553BRMZ |
| 标准包装： | 1 |
| 主要目的： | 接口，比较器 |
| 已用 IC / 零件： | ADCMP553 |
| 已供物品： | 板 |
| 相关产品： | ADCMP553BRMZ-ND - IC COMPARATOR PECL/LVPECL 8MSOP |
Data Sheet
ADCMP551/ADCMP552/ADCMP553
Rev. A | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltages
Input Supply Voltage (VCCI to GND)
0.5 V to +6.0 V
Output Supply Voltage (VCCO to GND)
0.5 V to +6.0 V
Ground Voltage Differential
0.5 V to +0.5 V
Input Voltages
Input Common-Mode Voltage
0.5 V to +3.5 V
Differential Input Voltage
4.0 V to +4.0 V
Input Voltage, Latch Controls
0.5 V to +5.5 V
Output
Output Current
30 mA
Temperature
Operating Temperature, Ambient
40°C to +85°C
Operating Temperature, Junction
125°C
Storage Temperature Range
65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CONSIDERATIONS
The ADCMP551 16-lead QSOP package has a θJA (junction-to-
ambient thermal resistance) of 104°C/W in still air.
The ADCMP552 20-lead QSOP package has a θJA (junction-to-
ambient thermal resistance) of 80°C/W in still air.
The ADCMP553 8-lead MSOP package has a θJA (junction-to-
ambient thermal resistance) of 130°C/W in still air.
ESD CAUTION
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| EVAL-ADCMP561BRQZ | 功能描述:BOARD EVALUATION ADCMP561BRQZ RoHS:是 类别:编程器，开发系统 >> 评估演示板和套件 系列:- 标准包装:1 系列:- 主要目的:电信，线路接口单元（LIU） 嵌入式:- 已用 IC / 零件:IDT82V2081 主要属性:T1/J1/E1 LIU 次要属性:- 已供物品:板，电源，线缆，CD 其它名称:82EBV2081 |
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