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参数资料
| 型号： | EXB28V |
| 英文描述： | Chip Resistor Array |
| 中文描述： | 片式电阻阵列 |
| 文件页数： | 1/10页 |
| 文件大小： | 105K |
| 代理商： | EXB28V |
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-28V02DE
Part No.
EXB28V
9999----1111
MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD.
1. Dimension
LW
T
A
B
Dimension(mm)
2.00
±0.10
1.00
±0.10
0.35
±0.05
0.20
±0.10
0.20
±0.10
PG
Dimension(mm)
0.50
±0.10
0.25
±0.10
2. Power derating curve
100
80
60
40
20
0
20
0
120
100
-40 -20
-60
80
60
40
140 160
-55
°C
70
°C
125
°C
Ambient Temperature(
°C)
Fig. 1
%
o
fra
te
ddi
ss
ip
at
io
n
Category temperature range
-55
°C to +125°C
3. Ratings
Item
Rated Value
Explanation
0.031 W / element
When used at ambient temperature over 70
°C,
the rated dissipation should be reduced as shown
in Fig.1
Rated Dissipation
Chip jumper : Rated current 1 A (Resistance is less than 50 m
)
Rated voltage
&
Rated Continuous
Working Voltage
(RCWV)
The rated voltage of each resistor should be calculated from the
equation below, and when the rated voltage exceeds the limiting
element voltage, the limiting element voltage should the maximum
working voltage.
E = P
× R
Limiting element voltage : 50 V
E: Rated voltage(V), P: Rated dissipation(W), R: Rated resistance(
))
(1)Substrate
(2)Protective
coating
(3)Resistive
element
Alumina
Resin
Ruthenium oxide
(4)Termination
(Inner)
(5)Termination
(Between)
(6) Termination
(Outer)
Ag or Ag/Pd
Side:Resin+Metal
Ni Plating
Sn or Sn/ Pb
Plating
A
P
T
W
B
L
B
G
(0.3)
(0.2)
a
a’
(1) (2) (3) (4) (5) (6)
a-a’ sectional plan
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