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参数资料
| 型号： | EXB28V |
| 英文描述： | Chip Resistor Array |
| 中文描述： | 片式电阻阵列 |
| 文件页数： | 4/10页 |
| 文件大小： | 105K |
| 代理商： | EXB28V |
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Spec. No.
151-EXB-28V02DE
Part No.
EXB28V
9999----3333
MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD.
As far as there shall be not designation especially, the following test and measurement shall be
operated under normal temperature(5
°C to 35 °C), normal humidity(45 %RH to 85 %RH),
normal atmospheric pressure(86 kPa to 106 kPa).
6. Performance Specification
Specification
Item
Resistor
Jumper
Test methods
DC resistance
DC resistance value shall be
within the specified tolerance
Measuring voltage: refer to JIS-C5201-1
At 20
°C, 65 %RH
Resistance
TCR
< 10
×10-6 / °C
10
to 1M±200 ×10-6 / °C
Temperature
coefficient
Natural resistance change per temperature
degree centigrade.
R2 - R1
R1×(t2 - t1)
R1 : Resistance value at reference
temperature(t1)
R2 : Resistance value at test
temperature(t2)
t2 - t1 = 100 °C, t1 = 25 °C
Overload
±(2 %+0.1 )
Less than
50 m
Resistors shall be applied 2.5 times the rated
voltage for 5 seconds.
Maximum over load voltage shall be 100 V.
Intermittent
overload
±(5 %+0.1 )
Less than
50 m
Resistors shall be subjected to 10000 cycles of
2.5 times the rated voltage applied for 1
second with pause of 25 seconds between
tests.
Maximum over load voltage shall be 100 V
Dielectric
Withstanding
No evidence of flashover,
mechanical damage, arcing or
insulation breakdown.
AC 100V between substrate and termination
for 1 minute.
Insulation
Resistance
Min. 1,000 M
Insulation resistance between substrate and
termination shall be measured at DC 100V.
7. Mechanical characteristic
Specification
Item
Resistor
Jumper
Test methods
Terminal strength min. 4.9N
Copper plate: t=0.4 mm
Pull speed: 10 mm/s
No mechanical damage
Bend strength of
the face plating
±(1 %+0.05 )
Less than
50 m
Substrate: Glass epoxy(t = 1.6 mm)
Span: 90 mm
Bending distance: 3 mm (10 seconds)
Solderability
Termination should be covered
uniformly with solder.
(min. 95 % coverage)
Resistors shall be dipped in the melted solder
bath at 235
°C ± 5 °C for 2 s ± 0.5 s. Flux shall
be removed from the surface of termination
with clean organic solvent.
TCR=
+600
100
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