参数资料
型号: FAN2108MPX
厂商: Fairchild Semiconductor
文件页数: 4/14页
文件大小: 0K
描述: IC REG BUCK SYNC ADJ 8A 25MLP
标准包装: 1
系列: TinyBuck™
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 0.8 V ~ 19 V
输入电压: 3 V ~ 24 V
PWM 型: 电流模式
频率 - 开关: 200kHz ~ 600kHz
电流 - 输出: 8A
同步整流器:
工作温度: -10°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 25-MLP
包装: 标准包装
供应商设备封装: 25-MLP(5x6)
产品目录页面: 1214 (CN2011-ZH PDF)
其它名称: FAN2108MPXDKR
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Parameter
VIN to PGND
VCC to AGND
BOOT to PGND
BOOT to SW
SW to PGND
All other pins
ESD
Conditions
AGND=PGND
Continuous
Transient (t < 20 ns, f < 600 KHz)
Human Body Model, JEDEC JESD22-A114
Charged Device Model, JEDEC JESD22-C101
Min.
-0.3
-0.5
-5
-0.3
2
2.5
Max.
28
6
35
6.0
24.0
30
V CC +0.3
Unit
V
V
V
V
V
V
V
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
V CC
V IN
T A
Parameter
Bias Voltage
Supply Voltage
Ambient Temperature
Conditions
VCC to AGND
VIN to PGND
FAN2108MPX
FAN2108EMPX
Min.
4.5
3
-10
-40
Typ.
5.0
Max.
5.5
24
+85
+85
Unit
V
V
°C
°C
T J
f
Junction Temperature
Switching Frequency
+125
600
°C
kHz
Thermal Information
Symbol
T STG
T L
T VP
T I
Parameter
Storage Temperature
Lead Soldering Temperature, 10 Seconds
Vapor Phase, 60 Seconds
Infrared, 15 Seconds
Min.
-65
Typ.
Max.
+150
+300
+215
+220
Unit
°C
°C
°C
°C
P1 (Q2)
4
°C/W
θ JC
Thermal Resistance: Junction-to-Case
P2 (Q1)
P3
7
4
°C/W
°C/W
Power Dissipation, T A =25°C
θ J-PCB
P D
Thermal Resistance: Junction-to-Mounting Surface (1)
(1)
35
2.8
°C/W
W
Note:
1. Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 25. Actual results
are dependent on mounting method and surface related to the design.
? 2008 Fairchild Semiconductor Corporation
FAN2108 ? Rev. 1.0.2
4
www.fairchildsemi.com
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