参数资料
型号: FAN3111ESX
厂商: Fairchild Semiconductor
文件页数: 2/18页
文件大小: 0K
描述: IC GATE DVR SGL 1A EXTER SOT23-5
特色产品: FAN3111/FAN3121/FAN3122 Single 1A & 9A High Speed, Low-Side Gate Drivers
标准包装: 1
配置: 低端
输入类型: 非反相
延迟时间: 15ns
电流 - 峰: 1.4A
配置数: 1
输出数: 1
电源电压: 4.5 V ~ 18 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: SC-74A,SOT-753
供应商设备封装: SOT-23-5
包装: 标准包装
产品目录页面: 1214 (CN2011-ZH PDF)
其它名称: FAN3111ESXDKR
Ordering Information
Part Number
FAN3111CSX
FAN3111ESX
Input
Threshold
CMOS
External
Package
5-Pin SOT23
5-Pin SOT23
Packing Method
Tape & Reel
Tape & Reel
Quantity per
Reel
3,000
3,000
Thermal Characteristics (1)
5-Pin SOT23
Package
Θ JL(2)
58
Θ JT(3)
102
Θ JA(4)
161
Ψ JB(5)
53
Ψ JT(6)
6
Units
°C/W
Notes:
1. Estimates derived from thermal simulation; actual values depend on the application.
2. Theta_JL ( Θ JL ): Thermal resistance between the semiconductor junction and the bottom surface of all the leads
(including any thermal pad) that are typically soldered to a PCB.
3. Theta_JT ( Θ JT ): Thermal resistance between the semiconductor junction and the top surface of the package,
assuming it is held at a uniform temperature by a top-side heatsink.
4. Theta_JA ( Θ JA ): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking,
and airflow. The value given is for natural convection with no heatsink using a 2S2P board,, as specified in
JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate.
5. Psi_JB ( Ψ JB ): Thermal characterization parameter providing correlation between semiconductor junction
temperature and an application circuit board reference point for the thermal environment defined in Note 4. For
the MLP-8 package, the board reference is defined as the PCB copper connected to the thermal pad and
protruding from either end of the package. For the SOIC-8 package, the board reference is defined as the PCB
copper adjacent to pin 6.
6. Psi_JT ( Ψ JT ): Thermal characterization parameter providing correlation between the semiconductor junction
temperature and the center of the top of the package for the thermal environment defined in Note 4.
Pin Definitions
Pin #
1
2
3
4
5
Name
VDD
GND
IN+
IN–
XREF
OUT
Description
Supply Voltage . Provides power to the IC.
Ground . Common ground reference for input and output circuits.
Non-Inverting Input . Connect to VDD to enable output.
FAN3111C Inverting Input . Connect to GND to enable output.
FAN3111E External Reference Voltage . Reference for input thresholds, 2V to 5V.
Gate Drive Output . Held low unless required inputs are present.
Output Logic with Dual-Input Configuration
0
0
1
1
IN+
(7)
(7)
1
1
IN ?
0
(7)
0
(7)
OUT
0
0
1
0
Note:
7. Default input signal if no external connection is made.
? 2008 Fairchild Semiconductor Corporation
FAN3111 ? Rev. 1.0.3
2
www.fairchildsemi.com
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