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参数资料
| 型号： | FAN5093MTC |
| 文件页数： | 11/21页 |
| 文件大小： | 500K |
| 代理商： | FAN5093MTC |
PRODUCT SPECIFICATION
FAN5093
REV. 1.0.8 2/4/02
19
PCB Layout Guidelines
Placement of the MOSFETs relative to the FAN5093 is
critical. Place the MOSFETs such that the trace length of
the HIDRV and LODRV pins of the FAN5093 to the FET
gates is minimized. A long lead length on these pins will
cause high amounts of ringing due to the inductance of the
trace and the gate capacitance of the FET. This noise
radiates throughout the board, and, because it is switching
at such a high voltage and frequency, it is very difcult to
suppress.
In general, all of the noisy switching lines should be kept
away from the quiet analog section of the FAN5093. That
is, traces that connect to pins 8-17 (LODRV, HIDRV,
PGND and BOOT) should be kept far away from the
traces that connect to pins 1 through 7, and pins 18-24.
Place the 0.1F decoupling capacitors as close to the
FAN5093 pins as possible. Extra lead length on these
reduces their ability to suppress noise.
Each power and ground pin should have its own via to the
appropriate plane. This helps provide isolation between
pins.
Place the MOSFETs, inductor, and Schottky of a given
phase as close together as possible for the same reasons as
in the rst bullet above. Place the input bulk capacitors as
close to the drains of the high side MOSFETs as possible.
In addition, placement of a 0.1
F decoupling cap right on
the drain of each high side MOSFET helps to suppress
some of the high frequency switching noise on the input
of the DC-DC converter.
Place the output bulk capacitors as close to the CPU as
possible to optimize their ability to supply instantaneous
current to the load in the event of a current transient.
Additional space between the output capacitors and the
CPU will allow the parasitic resistance of the board traces
to degrade the DC-DC converter’s performance under
severe load transient conditions, causing higher voltage
deviation. For more detailed information regarding
capacitor placement, refer to Application Bulletin AB-5.
A PC Board Layout Checklist is available from Fairchild
Applications. Ask for Application Bulletin AB-11.
PC Motherboard Sample Layout and Gerber File
A reference design for motherboard implementation of the
FAN5093 along with the PCAD layout Gerber le and silk
screen can be obtained through your local Fairchild repre-
sentative.
FAN5093 Evaluation Board
Fairchild provides an evaluation board to verify the system
level performance of the FAN5093. It serves as a guide to
performance expectations when using the supplied external
components and PCB layout. Please contact your local
Fairchild representative for an evaluation board.
Additional Information
For additional information contact your local Fairchild
representative.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| FAN5093MTC_Q | 功能描述:DC/DC 开关控制器 Sync Buck Converter 2Phs Interleaved RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| FAN5093MTCX | 功能描述:DC/DC 开关控制器 Sync Buck Converter 2Phs Interleaved RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
| FAN5094 | 制造商:FAIRCHILD 制造商全称:Fairchild Semiconductor 功能描述:Multi-Phase Interleaved Buck Converter |
| FAN5094MTC | 功能描述:直流/直流开关转换器 Buck Converter Hi Cur Sys Voltage RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| FAN5094MTC_Q | 功能描述:DC/DC 开关控制器 Buck Converter Hi Cur Sys Voltage RoHS:否 制造商:Texas Instruments 输入电压:6 V to 100 V 开关频率: 输出电压:1.215 V to 80 V 输出电流:3.5 A 输出端数量:1 最大工作温度:+ 125 C 安装风格: 封装 / 箱体:CPAK |
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