参数资料
型号: FAN5341UMPX
厂商: FAIRCHILD SEMICONDUCTOR CORP
元件分类: 显示驱动器
中文描述: LED DISPLAY DRIVER, PDSO6
封装: 2 X 2 MM, 0.55 MM HEIGHT, GREEN, MO-229, UMLP-6
文件页数: 6/11页
文件大小: 673K
代理商: FAN5341UMPX
2009 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN5341 Rev. 1.0.1
4
FA
N
5
341
Seri
es
B
oost
LED
D
river
wit
h
Int
e
grat
ed
Schottky
Diode
and
Singl
e-
W
ire
Digit
a
lInt
e
rf
ace
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings
are stress ratings only.
Symbol Parameter
Min.
Max.
Units
VIN
VIN
-0.3
6.0
V
VFB, VEN
FB, EN Pins
-0.3
VIN + 0.3
V
VSW
SW Pin
-0.3
22.0
V
VOUT
VOUT Pin
–0.3
22.0
V
ESD
Electrostatic Discharge Protection
Level
Human Body Model per JESD22-A114
3.3
kV
Charged Device Model per JESD22-C101
2.0
TJ
Junction Temperature
-40
+150
°C
TSTG
Storage Temperature
-65
+150
°C
TL
Lead Soldering Temperature, 10 Seconds
+260
°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding
them or designing to absolute maximum ratings.
Symbol
Parameter
Comments
Min.
Max.
Units
VIN
VIN Supply Voltage
2.7
5.5
V
VOUT
VOUT Voltage
(1)
6.2
17.5
V
IOUT
VOUT Load Current
500mW Maximum Output Power
5
25
mA
TA
Ambient Temperature
-40
+85
°C
TJ
Junction Temperature
-40
+125
°C
Note:
1.
Application should guarantee that minimum and maximum duty-cycle should fall between 20-85% to meet the specified
range
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 2s2p
boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature TJ(max) at a
given ambient temperature TA.
Symbol Parameter
Typical
Units
θJA
Junction-to-Ambient Thermal Resistance, UMLP6 Package
70
°C/W
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