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参数资料
| 型号： | FAN5902UCX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 4/8页 |
| 文件大小： | 0K |
| 描述： | IC CONV DC-DC 800MA RFPA 12WLCSP |
| 标准包装： | 3,000 |
| 应用： | 转换器，3G RF 功率放大器 |
| 输入电压： | 2.7 V ~ 5.5 V |
| 输出数： | 1 |
| 输出电压： | 0.4 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 12-UFBGA，WLCSP |
| 供应商设备封装： | 12-WLCSP |
| 包装： | 带卷 (TR) |
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Symbol
V IN
T J
T STG
T L
Parameter
AVIN, PVIN
Voltage On Any Other Pin
Junction Temperature
Storage Temperature
Lead Soldering Temperature (10 Seconds)
Min.
-0.3
-0.3
-40
-65
Max.
6.0
AV IN +0.3
+125
+150
+260
Unit
V
°C
°C
°C
θ JC
Thermal Resistance, Junction to Tab
(1)
MLP Package
5
°C/W
θ JC
Thermal Resistance, Junction to Case
(1)
WLCSP Package
30
°C/W
1. Refer to θ JA data below.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
V CC
V OUT
I OUT
L
C IN
Supply Voltage Range
Output Voltage Range
Output Current
Inductor
(2)
Input Capacitor
Parameter
Min.
2.7
0.4
20
10
Typ.
0.47
Max.
5.5
V IN
800
Unit
V
V
mA
μH
μF
C OUT
Output Capacitor
(2)
2.2
4.7
10.0
μF
T A
T J
Operating Ambient Temperature Range
Operating Junction Temperature Range
-40
-40
+85
+125
°C
°C
Notes:
2. A high input capacitor value is required for limiting input voltage drop during bypass transitions or during large
output voltage transitions. Ensure the input capacitor value is greater than the output capacitor’s. See the inrush
current specifications below.
3. Refer to application note AN-6087 for more details.
Dissipation Ratings (4)
θ JA
at T A ≤ 25°C
Package
(4)
Power Rating
(5)
Derating Factor
> T A =25oC
Molded Leadless Package (MLP)
49oC/W
(5)
2050mW
21mW/oC
Wafer-Level Chip-Scale Package (WLCSP)
110oC/W
(5)
900mW
9mW/oC
Notes:
4. Thermal Resistance, Junction-to-Ambient, measured according to JEDEC 2S2P PCB (and zero air flow). θ JA for
JEDEC 1S0P PCB (and zero air flow) = 210°C/W.
5. Maximum power dissipation is a function of T J(max) , θ JA , and T A . The maximum allowable power dissipation at any
allowable ambient temperature is P D =[T J(max) - T A ] / θ JA .
? 2009 Fairchild Semiconductor Corporation
FAN5902 ? Rev. 1.0.2.short
4
www.fairchildsemi.com
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