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参数资料
| 型号： | FAN5902UCX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 6/8页 |
| 文件大小： | 0K |
| 描述： | IC CONV DC-DC 800MA RFPA 12WLCSP |
| 标准包装： | 3,000 |
| 应用： | 转换器，3G RF 功率放大器 |
| 输入电压： | 2.7 V ~ 5.5 V |
| 输出数： | 1 |
| 输出电压： | 0.4 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 12-UFBGA，WLCSP |
| 供应商设备封装： | 12-WLCSP |
| 包装： | 带卷 (TR) |
Physical Dimensions
2X
0.10 A
3.50
A
PIN#1 IDENT
3.00
B
2.65
2.60
0.85
2.84
TOP VIEW
0.8 MAX
2X
0.10 B
1.85
1.05
0.10 C
(0.2)
0.85
LAND PATTERN RECOMMENDATION
0.08 C
0.05
0.00
SIDE VIEW
2.60+/-0.05
(0.38)
C
SEATING PLANE
PIN#1 IDENT
0.25+/-0.05
1
6
1.60+/-0.05
NOTES:
A. CONFORMS TO JEDEC MO-229
VARIATION WFED-2.
B. DIMENSIONS ARE IN MILLIMETERS
C. DIMENSIONS AND TOLERANCES PER
0.45+/-0.05
(12X)
ASME Y14.5M, 1994
D. LANDPATTERN RECOMMENDATION IS
BASED ON IPC 7351 DESIGN GUIDELINES
0.50
12
7
0.25+/-0.05 (12X)
E. LANDPATTERN EXTENSION TO INCLUDE
CENTER PAD TABS IS OPTIONAL
F. FILENAME AND REV: MKT-MLP12DREV1
BOTTOM VIEW
0.10
0.05
C A B
C
Figure 9: 3x3.5mm 12-Lead MLP
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/ .
? 2009 Fairchild Semiconductor Corporation
FAN5902 ? Rev. 1.0.2.short
6
www.fairchildsemi.com
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