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参数资料
| 型号： | FC250B1 |
| 厂商： | LINEAGE POWER LLC |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT 250 W DC-DC REG PWR SUPPLY MODULE |
| 封装： | MODULE-14 |
| 文件页数： | 5/20页 |
| 文件大小： | 752K |
| 代理商： | FC250B1 |
Lineage Power
13
Data Sheet
April 2008
18 Vdc to 36 Vdc Input, 12 Vdc Output; 250 W
FC250B1 Power Module: dc-dc Converter;
Thermal Considerations (continued)
Introduction (continued)
The temperature at this location should not exceed
100 °C. the maximum case temperature can be limited
to a lower value for extremely high reliability. The out-
put power of the module should not exceed the rated
power for the module as listed in the Ordering Informa-
tion table.
For additional information about these modules, refer
to the
Lineage Power Thermal Management for FC-
and FW-Series 250 W—300 W Board-Mounted Power
Modules Technical Note (TN96-009EPS).
Heat Transfer Without Heat Sinks
Derating curves for forced-air cooling without a heat
be used to determine the appropriate airflow for a given
set of operating conditions. For example, if the unit with
airflow along its length dissipates 20 W of heat, the
correct airflow in a 40 °C environment is 1.0 m/s
(200 ft./min.).
8-1315 (C)
Figure 19.Convection Power Derating with No Heat
Sink; Airflow Along Width; Transverse
Orientation
8-1314 (C)
Figure 20.Convection Power Derating with No Heat
Sink; Airflow Along Length; Longitudinal
Orientation
Heat Transfer with Heat Sinks
The power modules have through-threaded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to be attached to the module. The mounting torque
must not exceed 0.56 N-m (5 in.-lb.). For a screw
attachment from the pin side, the recommended hole
size on the customer’s PWB around the mounting
holes is 0.130 ± 0.005 inches. If a larger hole is used,
the mounting torque from the pin side must not exceed
0.25 N-m (2.2 in.-lb.).
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total
module thermal resistance (
θca) is defined as the max-
imum case temperature rise (
ΔTC, max) divided by the
module power dissipation (PD):
The location to measure case temperature (TC) is
shown in Figure 18. Case-to-ambient thermal resis-
tance vs. airflow for various heat sink configurations is
obtained by experimental testing of heat sinks, which
are offered in the product catalog.
0
102030
40
100
0
40
60
70
LOCAL AMBIENT TEMPERATURE, T A (C)
PO
WER
DISSIP
A
TION,
P
D
(W)
30
20
10
90
80
70
60
50
4.0 m/s (800 ft./m
3.5 m/s (700 ft./m
3.0 m/s (600 ft./m
2.5 m/s (500 ft./m
2.0 m/s (400 ft./m
1.5 m/s (300 ft./m
1.0 m/s (200 ft./m
0.5 m/s (100 ft./m
0.1 m/s (20 ft./min.) NAT. CONV.
0
102030
40
100
0
40
60
70
LOCAL AMBIENT TEMPERATURE, T A (C)
PO
WER
DISSIP
A
TION,
P
D
(W)
30
20
10
90
80
70
60
50
4.0 m/s (800 ft./m
3.5 m/s (700 ft./m
3.0 m/s (600 ft./m
2.5 m/s (500 ft./m
2.0 m/s (400 ft./m
1.5 m/s (300 ft./m
1.0 m/s (200 ft./m
0.5 m/s (100 ft./m
50
0.1 m/s (20 ft./min.) NAT. CONV.
θca
ΔT
C, max
PD
--------------------
TC TA
–
()
PD
------------------------
==
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