参数资料
型号: FDC5612
厂商: Fairchild Semiconductor
文件页数: 2/5页
文件大小: 0K
描述: MOSFET N-CH 60V 4.3A SSOT-6
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 08/April/2008
产品目录绘图: MOSFET SuperSOT-6
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 4.3A
开态Rds(最大)@ Id, Vgs @ 25° C: 55 毫欧 @ 4.3A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 18nC @ 10V
输入电容 (Ciss) @ Vds: 650pF @ 25V
功率 - 最大: 800mW
安装类型: 表面贴装
封装/外壳: SOT-23-6 细型,TSOT-23-6
供应商设备封装: 6-SSOT
包装: 标准包装
产品目录页面: 1602 (CN2011-ZH PDF)
其它名称: FDC5612DKR
Electrical Characteristics
T A = 25 ° C unless otherwise noted
Symbol
Parameter
Test Conditions
Min Typ
Max Units
Off Characteristics
BV DSS
? BV DSS
? T J
I DSS
I GSSF
I GSSR
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
V GS = 0 V, I D = 250 μ A
I D = 250 μ A, Referenced to 25 ° C
V DS = 48 V, V GS = 0 V
V GS = 20 V, V DS = 0 V
V GS = -20 V, V DS = 0 V
60
58
1
100
-100
V
mV/ ° C
μ A
nA
nA
On Characteristics
(Note 2)
V GS(th)
? V GS(th)
? T J
R DS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain-Source
On-Resistance
V DS = V GS , I D = 250 μ A
I D = 250 μ A, Referenced to 25 ° C
V GS = 10 V, I D = 4.3 A
V GS = 10 V, I D = 4.3 A, T J = 125 ° C
2
2.2
-5.5
0.042
0.072
4
0.055
0.094
V
mV/ ° C
?
V GS = 6 V, I D = 4 A
0.048
0.064
I D(on)
g FS
On-State Drain Current
Forward Transconductance
V GS = 10 V, V DS = 5 V
V DS = 10 V, I D = 4.3 A
10
14
A
S
Dynamic Characteristics
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V DS = 25 V, V GS = 0 V,
f = 1.0 MHz
650
80
35
pF
pF
pF
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Q g
Q gs
Q gd
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 30 V, I D = 1 A,
V GS = 10 V, R GEN = 6 ?
V DS = 30 V, I D = 4.3 A,
V GS = 10 V
11
8
19
6
12.5
2.4
2.6
20
18
35
15
18
ns
ns
ns
ns
nC
nC
nC
Drain-Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain-Source Diode Forward Current
1.3
A
V SD
Drain-Source Diode Forward Voltage
V GS = 0 V, I S = 1.3 A
(Note 2)
0.75
1.2
V
Notes:
1. R q JA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface
of the drain pins. R q JC is guaranteed by design while R q CA is determined by the user's board design.
a) 78 ° C/W when mounted on a 1.0 in 2 pad of 2 oz. copper.
b) 156 ° C/W when mounted on a minimum pad.
2. Pulse Test: Pulse Width £ 300 m s, Duty Cycle £ 2.0%
FDC5612 Rev. C2
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