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| 型号： | FDPF39N20 |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 1/10页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH 200V 39A TO-220F |
| 产品目录绘图： | MOSFET TO-220F |
| 标准包装： | 50 |
| 系列： | UniFET™ |
| FET 型： | MOSFET N 通道，金属氧化物 |
| FET 特点： | 标准 |
| 漏极至源极电压(Vdss)： | 200V |
| 电流 - 连续漏极(Id) @ 25° C： | 39A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 66 毫欧 @ 19.5A，10V |
| Id 时的 Vgs(th)（最大）： | 5V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 49nC @ 10V |
| 输入电容 (Ciss) @ Vds： | 2130pF @ 25V |
| 功率 - 最大： | 37W |
| 安装类型： | 通孔 |
| 封装/外壳： | TO-220-3 整包 |
| 供应商设备封装： | TO-220F |
| 包装： | 管件 |
| 产品目录页面： | 1607 (CN2011-ZH PDF) |
November 2013
FDP39N20 / FDPF39N20
N-Channel UniFET TM MOSFET
200 V, 39 A, 66 m Ω
Features
? R DS(on) = 66 m Ω (Max.) @ V GS = 10 V, I D = 19.5 A
? Low Gate Charge (Typ. 38 nC)
? Low C rss (Typ. 57 pF)
? 100% Avalanche Tested
Applications
Description
UniFET TM MOSFET is Fairchild Semiconductor ’s high voltage
MOSFET family based on planar stripe and DMOS technology.
This MOSFET is tailored to reduce on-state resistance, and to
provide better switching performance and higher avalanche
energy strength. This device family is suitable for switching
power converter applications such as power factor correction
(PFC), flat panel display (FPD) TV power, ATX and electronic
lamp ballasts.
? PDP TV
? Lighting
? Uninterruptible Power Supply
? AC-DC Power Supply
D
D
D
G
S
TO-220
G
S
TO-220F
G
S
Absolute Maximum Ratings
T C = 25°C unless otherwise noted.
Symbol
V DSS
Drain-Source Voltage
Parameter
FDP39N20
200
FDPF39N20
Unit
V
I D
Drain Current
- Continuous (T C = 25 ° C)
- Continuous (T C = 100 ° C)
39
23 . 4
39 *
23.4 *
A
A
I DM
Drain Current
- Pulsed
(Note 1)
156
156 *
A
V GSS
Gate-Source voltage
± 30
V
E AS
I AR
E AR
dv/dt
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
(Note 2)
(Note 1)
(Note 1)
(Note 3)
860
39
25.1
4.5
mJ
A
mJ
V/ns
P D
Power Dissipation
(T C = 25 ° C)
- Derate Above 25 ° C
251
2.0
37
0.29
W
W/ ° C
T J, T STG
T L
Operating and Storage Temperature Range
Maximum Lead Temperature for Soldering,
1/8” from Case for 5 Seconds
-55 to +150
300
° C
° C
* Drain current limited by maximum junction temperature.
Thermal Characteristics
Symbol
R θ JC
R θ JA
Parameter
Thermal Resistance, Junction-to-Case, Max.
Thermal Resistance, Junction-to-Ambient, Max.
FDP39N20
0.5
62.5
FDPF39N20
3.4
62.5
Unit
° C/W
?2007 Fairchild Semiconductor Corporation
FDP39N20 / FDPF39N20 Rev. C1
1
www.fairchildsemi.com
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