参数资料
型号: FDS86140
厂商: Fairchild Semiconductor
文件页数: 2/6页
文件大小: 0K
描述: MOSFET N-CH 100V 11.2A 8SOIC
标准包装: 2,500
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 100V
电流 - 连续漏极(Id) @ 25° C: 11.2A
开态Rds(最大)@ Id, Vgs @ 25° C: 9.8 毫欧 @ 11.2A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 41nC @ 10V
输入电容 (Ciss) @ Vds: 2580pF @ 50V
功率 - 最大: 2.5W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 带卷 (TR)
Electrical Characteristics T J = 25 °C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV DSS
Δ BV DS S
Δ T J
I DSS
I GSS
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
I D = 250 μ A, V GS = 0 V
I D = 250 μ A, referenced to 25 °C
V DS = 80 V, V GS = 0 V
V GS = ±20 V, V DS = 0 V
100
70
1
±100
V
mV/°C
μ A
nA
On Characteristics
V GS(th)
Δ V GS(th)
Δ T J
Gate to Source Threshold Voltage
Gate to Source Threshold Voltage
Temperature Coefficient
V GS = V DS , I D = 250 μ A
I D = 250 μ A, referenced to 25 °C
2
2.7
-11
4
V
mV/°C
V GS = 10 V, I D = 11.2 A
8.1
9.8
r DS(on)
g FS
Static Drain to Source On Resistance
Forward Transconductance
V GS = 6 V, I D = 9 A
V GS = 10 V, I D = 11.2 A,
T J = 125 °C
V DS = 10 V, I D = 11.2 A
10.8
13.1
35
16
17
m Ω
S
Dynamic Characteristics
C iss
C oss
C rss
R g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V DS = 50 V, V GS = 0 V,
f = 1 MHz
1940
440
20
0.9
2580
585
30
pF
pF
pF
Ω
Switching Characteristics
t d(on)
Turn-On Delay Time
13.7
25
ns
t r
t d(off)
t f
Q g
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
V DD = 50 V, I D = 11.2 A,
V GS = 10 V, R GEN = 6 Ω
V GS = 0 V to 10 V
5.6
23
4.8
29
11
38
10
41
ns
ns
ns
nC
Q g
Q gs
Total Gate Charge
Gate to Source Charge
V GS = 0 V to 5 V
V DD = 50 V,
I D = 11.2 A
16.5
8.0
23
nC
nC
Q gd
Gate to Drain “Miller” Charge
6.5
nC
Drain-Source Diode Characteristics
V SD
Source-Drain Diode Forward Voltage
V GS = 0 V, I S = 11.2 A
V GS = 0 V, I S = 2 A
(Note 2)
(Note 2)
0.8
0.7
1.3
1.2
V
t rr
Q rr
Reverse Recovery Time
Reverse Recovery Charge
I F = 11.2 A, di/dt = 100 A/ μ s
53
59
85
94
ns
nC
NOTES:
1. R θ JA is determined with the device mounted on a 1 in 2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R θ JC is guaranteed by design while R θ CA is determined by
the user's board design.
a) 50 °C/W when mounted on a
1 in 2 pad of 2 oz copper.
2. Pulse Test: Pulse Width < 300 μ s, Duty cycle < 2.0%.
3. Starting T J = 25 °C, L = 1 mH, I AS = 23 A, V DD = 90 V, V GS = 10 V.
b) 125 °C/W when mounted on a
minimum pad.
?2011 Fairchild Semiconductor Corporation
FDS86140 Rev.C
2
www.fairchildsemi.com
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