参数资料
型号: FI105B245024-T
厂商: Taiyo Yuden
文件页数: 11/14页
文件大小: 0K
描述: FILTER BANDPASS 2.5GHZ SMD
标准包装: 1
系列: FI
频率: 2.45GHz Center
带宽: 100MHz
滤波器类型: 带通
纹波: 1dB
插入损耗: 3dB
封装/外壳: 0402(1005 公制),4 PC 板
安装类型: 表面贴装
包装: 标准包装
高度(最大): 0.013"(0.33mm)
尺寸/尺寸: 0.039" L x 0.020" W(1.00mm x 0.50mm)
其它名称: 587-2908-6
MULTILAYER CERAMIC DEVICES (FILTERS / DIPLEXERS / BALUNS)
■ RELIABILITY DATA
1. Operating Temperature Range
Specified Value
-30~+85℃
2. Storage Temperature Range
Specified Value
Test Methods and
Remarks
-30~+85℃
※Note : -20 to +40℃ in taped packaging
3. Resistance to Flexure of Substrate
Specified Value
No mechanical damage.
Warp
Testing board
Thickness
Test Methods and
Remarks
4. Adhesion of Electrode
: 2mm
: Glass epoxy-resin substrate
: 0.8mm
Specified Value
Test Methods and
Remarks
5. Solderability
Characteristics
Appearance
Applied force
Duration
: shall satisfy the electrical characteristics.
: No significant abnormality.
: 5N
: 10 sec.
Specified Value
75% or more of immersed surface of terminal electrode shall be covered with fresh solder.
Solder temperature
: 230±5℃
Test Methods and
Remarks
Duration
Preconditioning
Immersion and Removal speed
: 4±1 sec
: Immersion into flux.
: 25mm/sec.
6. Resistance to Solder Heat
Specified Value
Characteristics
Appearance
: shall satisfy the electrical characteristics.
: No significant abnormality.
Preheating
Solder temperature
:
:
150℃ for 2 min.
260±5℃
Test Methods and
Remarks
Duration
Preconditioning
Immersion and Removal speed
Recovery
:
:
:
:
5±0.5 sec.
Immersion into flux.
25mm/sec.
2 to 3hrs of recovery under the standard condition after the removal from test chamber.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
chipfilter_reli_e-E02R01
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