参数资料
型号: FP1007R3-R12-R
厂商: Cooper Bussmann
文件页数: 39/56页
文件大小: 0K
描述: INDUCTOR LO PROFLE 120NH 61A SMD
特色产品: FP/HCP Series Inductors
标准包装: 650
系列: FLAT-PAC™, FP1007
电感: 120nH
电流: 61A
电流 - 饱和: 94A
类型: 铁氧体芯体
容差: ±10%
屏蔽: 无屏蔽
DC 电阻(DCR): 0.29 毫欧
材料 - 芯体: 铁氧体
封装/外壳: 0.402" L x 0.307" W x 0.287" H(10.20mm x 7.80mm x 7.30mm)
安装类型: 表面贴装
包装: 带卷 (TR)
工作温度: -40°C ~ 125°C
频率 - 测试: 100kHz
Coiltronics ? High Frequency Inductor Catalog
HCP0704 Series
Applications:
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Voltage Regulator Module (VRM)
Multi-phase regulators
Desktop and servers
Base station equipment
Notebook regulators
Data networking and storage systems
Point-of-load modules
Battery power systems
DCR sensing
Environmental Data:
SMD Device
Description:
? Storage temperature range: -40°C to +155°C
? Operating temperature range: -40°C to +155°C
(Range is application specific)
? Solder reflow temperature: J-STD-020D compliant
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Halogen free
155°C maximum total temperature operation
6.8 x 6.8 x 4.2mm surface mount package
Powder iron core material
Magnetically shielded, low EMI
High temperature core material eliminates thermal aging issues
High current carrying capacity, low core losses
Controlled DCR tolerance for sensing circuits
Inductance range from 0.40 μ H to 4.7 μ H
Current range from 5.0 to 27 amps
Frequency range up to 2MHz
RoHS compliant
Packaging:
? Supplied in tape-and-reel packaging, 1000 parts per reel,
13” diameter reel
Product Specifications
Part Number 6
HCP0704-R40-R
HCP0704-R60-R
HCP0704-1R0-R
HCP0704-1R8-R
HCP0704-2R3-R
HCP0704-3R3-R
HCP0704-4R7-R
OCL 1 ± 25% ( μ H)
0.40
0.50
1.00
1.80
2.30
3.30
4.70
FLL 2 Min. ( μ H)
0.28
0.42
0.7
1.26
1.56
2.31
3.29
Irms 3 (Amps)
17
14
12
8.5
7.5
6.0
5.0
Isat 4 @ 25°C (Amps)
27
21
17
13
11.5
9.5
8.0
DCR (m Ω ) @ 20°C
3.2 ±10%
4.5 ±10%
6.2 ±10%
11.0 ±10%
16.5 ±10%
25.0 ±10%
29.5 ±10%
K-factor 5
383.1
313.5
265.3
202.8
164.2
149.9
127.7
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
4 Isat: Peak current for approximately 20% rolloff at +25°C.
5 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * Δ I : (Gauss), K: (K-factor
from table), L: (inductance in μ H), Δ I (peak-to-peak ripple current in amps).
6 Part Number Definition: HCP0704-xxx-R
? HCP0704 = Product code and size
? xxx= Inductance value in μ H, R = decimal point. If no “R” is present, then
third character = # of zeros
? “-R” suffix = RoHS compliant
For product information and data sheets, visit www.cooperbussmann.com/datasheets/elx
39
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