参数资料
型号: FP1007R3-R23-R
厂商: Cooper Bussmann
文件页数: 37/56页
文件大小: 0K
描述: INDUCTOR LO PROFLE 230NH 61A SMD
特色产品: FP/HCP Series Inductors
标准包装: 650
系列: FLAT-PAC™, FP1007
电感: 230nH
电流: 61A
电流 - 饱和: 48A
类型: 铁氧体芯体
容差: ±10%
屏蔽: 无屏蔽
DC 电阻(DCR): 0.29 毫欧
材料 - 芯体: 铁氧体
封装/外壳: 0.402" L x 0.307" W x 0.287" H(10.20mm x 7.80mm x 7.30mm)
安装类型: 表面贴装
包装: 带卷 (TR)
工作温度: -40°C ~ 125°C
频率 - 测试: 100kHz
Coiltronics ? High Frequency Inductor Catalog
FLAT-PAC? FP3 Series
Applications
?
?
?
?
Computers and portable power devices
Energy storage applications
DC-DC converters
Input - output filter application
Environmental Data
? Storage temperature range: -40°C to +155°C
? Operating ambient temperature range: -40°C to +155°C
(Range is application specific)
SMD Device
Description
? 155°C maximum total temperature operation
? Solder reflow temperature: +260°C max. for 10 seconds max.
Packaging
? Units supplied in tape-and-reel packaging,1700 parts per reel,
13” diameter reel
?
?
?
Low-profile high current inductors
Inductance range 0.1 μ H to 15 μ H
Design utilizes high temperature powder iron material with a
non-organic binder to eliminate thermal aging
? Current rating up to 34.7Adc (higher peak currents may be attained
with a greater rolloff, see rolloff curve)
? Frequency range up to 2MHz
Product Specifications
Isat
Isat
Part
Number
FP3-R10-R
FP3-R20-R
FP3-R47-R
FP3-R68-R
FP3-1R0-R
FP3-1R5-R
FP3-2R0-R
FP3-3R3-R
FP3-4R7-R
FP3-8R2-R
FP3-100-R
FP3-150-R
Rated
Inductance
μH
0.10
0.20
0.47
0.68
1.00
1.50
2.00
3.30
4.70
8.20
10.0
15.0
OCL 1
μH ± 15%
0.10
0.22
0.44
0.72
1.10
1.50
2.00
3.20
4.70
8.5
10.9
14.9
Irms 2
Amps
19.0
15.3
10.9
9.72
6.26
5.78
5.40
3.63
3.23
2.91
2.30
2.22
3
Amps
Approx. 10%
27
16
11.6
9.0
7.4
6.2
5.4
4.3
3.5
2.6
2.3
2.0
4
Amps
Approx. 15%
34.7
20.8
14.9
11.6
9.5
8.0
6.9
5.5
4.2
3.4
3.0
2.5
DCR
(m Ω) @ 20°C
(Max.)
1.21
1.88
3.67
4.63
11.2
13.1
15.0
30.0
40.0
74.0
101
127
K-factor
803
482
344
268
219
185
161
127
105
78
69
59
5
1 OCL (Open Circuit Inductance) Test parameters: 100kHz, 0.1Vrms, 0.0Adc
2 DC current for an approximate Δ T of 40°C without core loss. Derating is necessary for AC
currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating
components will affect the temperature rise. It is recommended that the temperature of the part
not exceed 155°C under worst case operating conditions verified in the end application.
Dimensions - mm
3 Isat Amps Peak for approximately 10% rolloff @ 20°C
4 Isat Amps Peak for approximately 15% rolloff @ 20°C
5 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p =K*L*3I Bp-p: (Gauss), K: (K
factor from table), L: (Inductance in μ H), Δ I (Peak to peak ripple current in Amps).
Front View
Top View
Side View
Recommended Pad Layout
Schematic
2.80.25
(2x)
1
FP3
1.0 min.
(2x)
1
3.00 Max
XXX
yww
7.25
Max
7.50
2.50 (2x)
2.80.25
(2x)
2
6.70
4.50 (2x)
2
Max
For product information and data sheets, visit www.cooperbussmann.com/datasheets/elx
37
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