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参数资料
| 型号： | FPF1016 |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 9/11页 |
| 文件大小： | 0K |
| 描述： | IC LOAD SWITCH 1V ADVANCED 6UMLP |
| 产品变化通告： | Pkg Change 13/Jul/2009 |
| 标准包装： | 3,000 |
| 系列： | IntelliMax™ |
| 类型： | 高端开关 |
| 输出数： | 1 |
| Rds（开）： | 45 毫欧 |
| 内部开关： | 是 |
| 电流限制： | 1.5A |
| 输入电压： | 0.8 V ~ 1.8 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-UMLP |
| 供应商设备封装： | 6-UMLP（2x2） |
| 包装： | 带卷 (TR) |
Improving Thermal Performance
An improper layout could result in higher junction temperature.
This concern applies when the current is at its continuous
maximum value and is then switched into a large capacitive
load that introduces a large transient current. Since the
FPF1015/6/7/8 does not have thermal shutdown capability, a
proper layout is essential to improving power dissipation of the
switch in transient events and prevents the switch from
exceeding the maximum absolute power dissipation of 1.2W.
The following techniques have been identified to improve the
thermal performance of this family of devices. These techniques
are listed in order of the significance of their impact.
1. Thermal performance of the load switch can be improved by
connecting pin7 of the DAP (Die Attach Pad) to the GND plane
of the PCB.
2. Embedding two exposed through-hole vias into the DAP
(pin7) provides a path for heat to transfer to the back GND
plane of the PCB. A drill size of Round, 14 mils (0.35mm) with
1-ounce copper plating is recommended to result in appropriate
solder reflow. A smaller size hole prevents the solder from
penetrating into the via, resulting in device lift-up. Similarly, a
larger via-hole consumes excessive solder, and may result in
voiding of the DAP.
1 4 M il
1 5 M il
Figure 19: Two through hole open vias embedded in DAP
3. The V IN , V OUT and GND pins will dissipate most of the heat
generated during a high load current condition. The layout
suggested in Figure 20 provides each pin with adequate copper
so that heat may be transferred as efficiently as possible out of
the device. The ON pin trace may be laid-out diagonally from
the device to maximize the area available to the ground pad.
Placing the input and output capacitors as close to the device as
possible also contributes to heat dissipation, particularly during
high load currents.
Figure 20: Proper layout of output, input and ground copper
area
Demo Board Layout
FPF1015/6/7/8 Demo board has the components and circuitry
to demonstrate FPF1015/6/7/8 load switches functions.
Thermal performance of the board is improved using a few
techniques recommended in the layout recommendations
section of datasheet.
Figure 21. FPF1015/6/7/8 Demo board TOP, SST, ASTOP
and DRL layers
FPF1015/6/7/8 Rev. D
9
www.fairchildsemi.com
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PDF描述 |
|---|---|
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| HFI-201209-R15J | INDUCTOR 2.0X1.2X0.9MM 150NH |
| OPAMPEVM-SOT23SHDN | UNIV EVAL MOD FOR SOT23 PKG |
| VE-25H-EY | CONVERTER MOD DC/DC 52V 50W |
| MLG1005S0N8C | INDUCTOR MULTILAYER 0.8NH 0402 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| FPF1017 | 功能描述:电源开关 IC - 配电 Intellimax Advanced Load Manag Products RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| FPF1018 | 功能描述:电源开关 IC - 配电 Intellimax Advanced Load Manag Products RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| FPF1026_AAB3026D WAF | 制造商:Fairchild Semiconductor Corporation 功能描述: |
| FPF1026_AAB3086D WAF | 制造商:Fairchild Semiconductor Corporation 功能描述: |
| FPF1038 | 制造商:FAIRCHILD 制造商全称:Fairchild Semiconductor 功能描述:Low On-Resistance, Slew-Rate-Controlled Load Switch |
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