参数资料
| 型号： | FPF1208UCX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 11/12页 |
| 文件大小： | 0K |
| 描述： | IC LOAD SWITCH ADV 4WLCSP |
| 标准包装： | 1 |
| 系列： | IntelliMax™ |
| 类型： | 通用 |
| 输出数： | 1 |
| Rds（开）： | 66 毫欧 |
| 内部开关： | 是 |
| 输入电压： | 1.2 V ~ 4 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 4-UFBGA，WLCSP |
| 供应商设备封装： | 4-WLCSP（0.76x0.76） |
| 包装： | 标准包装 |
| 其它名称： | FPF1208UCXDKR |
Physical Dimensions
2X
0.03 C
E
A
B
F
0.40
?0.20
A1
Cu Pad
BALL A1
D
0.40
INDEX AREA
TOP VIEW
2X
0.03 C
?0.30
Solder Mask
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.06 C
0.05 C
C
0.539
0.461
SEATING PLANE
D
E
SIDE VIEWS
0.292±0.018
0.208±0.021
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
0.005
C A B
B. DIMENSIONS ARE IN MILLIMETERS.
0.40
?0.260±0.020
4X
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
0.40
B
A
(Y)±0.018
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
1 2
(X)±0.018
F
E. PACKAGE NOMINAL HEIGHT IS 500 MICRONS
±39 MICRONS (461-539 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
BOTTOM VIEW
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC004AFrev1.
Figure 27. 4 Ball, 0.76 x 0.76 mm Wafer Level Chip Scale WLCSP Packaging
Product-Specific Dimensions
Product
FPF1207UCX
FPF1208UCX
D
760μm ± 30μm
760μm ± 30μm
E
760μm ± 30μm
760um ± 30μm
X
0.180mm± 0.018μm
0.180mm± 0.018μm
Y
0.180mm± 0.018μm
0.180mm± 0.018μm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for
the most recent package drawing: http://www.fairchildsemi.com/packaging/.
? 2010 Fairchild Semiconductor Corporation
FPF1207 / FPF1208 ? Rev. 1.0.0
11
www.fairchildsemi.com
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