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| 型号： | FPF2200 |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 10/13页 |
| 文件大小： | 0K |
| 描述： | IC LOAD SWITCH 500MA 6-MICROFET |
| 标准包装： | 1 |
| 类型： | 高端开关 |
| 输出数： | 1 |
| Rds（开）： | 185 毫欧 |
| 内部开关： | 是 |
| 电流限制： | 500mA |
| 输入电压： | 1.8 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-MLP |
| 供应商设备封装： | 6-MicroFET（2x2） |
| 包装： | 标准包装 |
| 其它名称： | FPF2200DKR |
Application Information
Input Capacitor
To limit the voltage drop on the input supply caused by transient
in-rush currents when the switch is turned on into a discharged
load capacitor or a short-circuit, a capacitor is recommended to
be placed between V IN and GND. A 1uF ceramic capacitor, C IN ,
placed close to the pins is usually sufficient. Higher values of
C IN can be used to further reduce the voltage drop.
Output Capacitor
A 0.1uF capacitor C OUT , should be placed between V OUT and
GND. This capacitor will prevent parasitic board inductances
from forcing V OUT below GND when the switch turns-off. For the
FPF2200 and FPF2201, the total output capacitance needs to
be kept below a maximum value, C OUT (max), to prevent the
part from registering an over-current condition and turning-off
the switch. The maximum output capacitance can be
determined from the following formula:
PCB Layout Recommendations
For best performance, all traces should be as short as possible.
To be more effective, the input and output capacitors should be
placed close to the device to minimize the effects that parasitic
trace inductances may have on normal and short-circuit
operation. Using wide traces for V IN , V OUT and GND will help
minimize parasitic electrical effects along with minimizing the
case to ambient thermal impedance.
Improving Thermal Performance
An improper layout could result in higher junction temperature
and triggering the thermal shutdown protection feature. This
concern applies when the switch is set at higher current limit
value and an over-current condition occurs. In this case, the
power dissipation of the switch, from the formula below, could
exceed the maximum absolute power dissipation of 1.2W.
PD = (V IN - V OUT ) x I LIM (Max)
C OUT (Max) =
I LIM (Max) X t BLANK (Min)
V IN
The following techniques have been identified to improve the
thermal performance of this family of devices. These
techniques are listed in order of the significance of their impact.
Power Dissipation
During normal on-state operation, the power dissipated in the
device will depend upon the level at which the current limit is
set. The maximum allowed setting for the current limit is 500mA
1. Thermal performance of the load switch can be improved by
connecting pin7 of the DAP (Die Attach Pad) to the GND plane
of the PCB.
and will result in a power dissipation of:
2.
Embedding two exposed through-hole vias into the DAP
(pin7) provides a path for heat to transfer to the back GND
P = (I LIM ) 2 * R ON = (0.5) 2 * 0.16 = 40mW
plane of the PCB. A drill size of Round, 14 mils (0.35mm) with
1-ounce copper plating is recommended to result in appropriate
solder reflow.
A smaller size hole prevents the solder from
If the part goes into current limit, the maximum power
dissipation will occur when the output is shorted to ground. For
the FPF2200, the power dissipation will scale by the Auto-
Restart Time, t RSTRT , and the Over Current Blanking Time,
t BLANK , so that the maximum power dissipated is:
penetrating into the via, resulting in device lift-up. Similarly, a
larger via-hole consumes excessive solder, and may result in
voiding of the DAP.
P (Max) =
t BLANK
t BLANK + t RSTRT
* V IN (Max) * I LIM (Max)
=
30
30 + 450
* 5.5 * 0.5 = 0.17W
Note this is below the maximum package power dissipation, and
the thermal shutdown feature will act as additional safety to
protect the part from damage due to excessive heating. The
junction temperature is only able to increase to the thermal
shutdown threshold. Once this temperature has been reached,
toggling ON will not turn-on the switch until the junction
temperature drops. For the FPF2202, a short on the output will
cause the part to operate in a constant current state dissipating
a worst case power of:
P (Max) = V IN (MAX) * I LIM (MAX) = 5.5 * 0.557 = 3.064W
This large amount of power will activate the thermal shutdown
and the part will cycle in and out of thermal shutdown so long as
the ON pin is active and the short is present.
Figure 21: Two through hole open vias embedded in DAP
3. The V IN , V OUT and GND pins will dissipate most of the heat
generated during a high load current condition. The layout
suggested in Figure 23 provides each pin with adequate copper
so that heat may be transferred as efficiently as possible out of
the device. The low-power FLAGB and ON pin traces may be
laid-out diagonally from the device to maximize the area
available to the ground pad. Placing the input and output
capacitors as close to the device as possible also contributes to
heat dissipation, particularly during high load currents.
FPF2200-FPF2202 Rev. B
10
www.fairchildsemi.com
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| FPF2201 | 功能描述:电源开关 IC - 配电 Integrated w/500mA Precision Crnt Limit RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| FPF2202 | 功能描述:电源开关 IC - 配电 Integrated w/500mA Precision Crnt Limit RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| FPF2213 | 功能描述:电源开关 IC - 配电 Adj High Precision Current Limit RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| FPF2214 | 功能描述:电源开关 IC - 配电 Adj High Precision Current Limit RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
| FPF2215 | 功能描述:电源开关 IC - 配电 Adj High Precision Current Limit RoHS:否 制造商:Exar 输出端数量:1 开启电阻（最大值）:85 mOhms 开启时间（最大值）:400 us 关闭时间（最大值）:20 us 工作电源电压:3.2 V to 6.5 V 电源电流（最大值）: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOT-23-5 |
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