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参数资料
| 型号： | FPF2313LMPX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 14/17页 |
| 文件大小： | 0K |
| 描述： | IC LOAD SW 2CH ADJ CURR 8-MLP |
| 标准包装： | 1 |
| 系列： | IntelliMax™ |
| 类型： | 高端开关 |
| 输出数： | 2 |
| Rds（开）： | 140 毫欧 |
| 内部开关： | 是 |
| 电流限制： | 可调 |
| 输入电压： | 1.8 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-MLP |
| 供应商设备封装： | 8-MLP（3x3） |
| 包装： | 标准包装 |
| 产品目录页面： | 1218 (CN2011-ZH PDF) |
| 其它名称： | FPF2313LMPXDKR |
Host (5V)
1μF
IN
ISETA
ISETB
OFF
ON
ONA
FPF2310/2/3
OUTA
OFF
ON
ONA
GND
OUTB
Downstream
USB Port
33μF
Figure 38. Self-Power USB for High Current Demand
If the part goes into current limit, the maximum power
dissipation occurs when the output of switch is shorted to
ground. For the FPF2310, the power dissipation scales with the
auto-restart time, t RSTRT , and the over-current blanking time,
t BLANK . In this case, the maximum power dissipated for the
FPF2310 is:
t BLANK
P D_MAX(CurrentLimit) = 2 x x IN (MAX) x I LIM(MAX)
t BLANK + t RSTRT
(8)
PCB Layout Recommendations
For the best performance, all traces should be as short as
possible. To be most effective, the input and output capacitors
should be placed close to the device to minimize the effects that
parasitic trace inductances may have on normal and short-
circuit operation. Using wide traces for IN, OUTs, and GND pins
helps minimize parasitic electrical effects along with minimizing
the case-to-ambient thermal impedance.
Which results in:
P D_MAX(CurrentLimit) = 2 x
10
10 + 150
x 5.5 x 0.74 = 508mW (9)
Improving Thermal Performance of the
FPF231X Family of Devices
Improper layout could result in higher junction temperature and
triggering the thermal shutdown protection feature. This concern
applies particularly to the FPF2313 and FPF2313L, where both
Note that this is below the maximum package power dissipation
and the thermal shutdown feature protection provides additional
safety to protect the part from damage due to excessive
heating. The junction temperature is only able to increase to the
thermal shutdown threshold. Once this temperature has been
reached, toggling ON has no effect until the junction
temperature drops below the thermal shutdown exit
temperature. For the FPF2313 and FPF2313L, a short on the
both outputs causes both switches to operate in a constant-
current state and dissipating a worst-case power of:
channels operate in constant-current mode in the overload
conditions and; during fault condition, the outputs are shorted,
resulting to large voltage drop across switches. In this case,
power dissipation of the switch (P D = (V IN - V OUT ) x I LIM(MAX) )
could exceed the maximum absolute power dissipation of part.
The following techniques improve the thermal performance of
this family of devices. These techniques are listed in order of
the significance of impact.
1. Thermal performance of the load switch can be improved by
connecting the DAP (Die Attach Pad) of MLP 3x3mm
P MAX = IN (MAX) x I LIM(MAX) = 2 x 5.5 x 0.74 = 8.14W
(10)
package to the GND plane of the PCB.
2. Embedding two exposed through-hole vias into the DAP (pin
As both FPF2313/3L outputs are connected to GND.
This power dissipation is significant and activates both thermal
shutdown blocks. The part cycles in and out of thermal
shutdown as long as the ON pin is activated (pulled LOW) and
the output short is present.
If high current of over 1A is required to supply enough power to
a downstream function, dual outputs can be tied together as
shown in Figure 38.
? 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L ? Rev. 1.1.3
14
9) provides a path for heat to transfer to the back GND plane
of the PCB. A drill size of round, 15 mils (0.4mm) with 1-
ounce copper plating is recommended to create appropriate
solder reflow. A smaller size hole prevents the solder from
penetrating into the via, resulting in device lift-up. Similarly, a
larger via-hole consumes excessive solder and may result in
voiding the DAP.
www.fairchildsemi.com
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