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参数资料
| 型号： | FPF2313LMPX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 4/17页 |
| 文件大小： | 0K |
| 描述： | IC LOAD SW 2CH ADJ CURR 8-MLP |
| 标准包装： | 1 |
| 系列： | IntelliMax™ |
| 类型： | 高端开关 |
| 输出数： | 2 |
| Rds（开）： | 140 毫欧 |
| 内部开关： | 是 |
| 电流限制： | 可调 |
| 输入电压： | 1.8 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-MLP |
| 供应商设备封装： | 8-MLP（3x3） |
| 包装： | 标准包装 |
| 产品目录页面： | 1218 (CN2011-ZH PDF) |
| 其它名称： | FPF2313LMPXDKR |
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only .
0.6
Symbol
P D
T STG
Θ JA
Parameter
IN, OUTA, OUTB, ON to GND
Power Dissipation
Storage Temperature
Thermal Resistance, Junction-to-Ambient
Min.
-0.3
-65
Max.
6.0
(1.)
2.2 (2.)
+150
216 (1.)
57 (2.)
Unit
V
W
°C
°C/W
ESD
Electrostatic Discharge Protection
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
4000
2000
V
V
Notes:
1. Soldered thermal pad on a two-layer PCB without vias based on JEDEC STD 51-3.
2.
Soldered thermal pad on a four-layer PCB without vias connected with GND plane based on JEDEC STD51-5, 7.
Recommended Operating Range
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
IN
T A
Parameter
Supply Input
Ambient Operating Temperature
Min.
1.8
-40
Max.
5.5
+85
Unit
V
°C
? 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L ? Rev. 1.1.3
4
www.fairchildsemi.com
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