参数资料
型号: FQB27P06TM
厂商: Fairchild Semiconductor
文件页数: 1/8页
文件大小: 0K
描述: MOSFET P-CH 60V 27A D2PAK
产品目录绘图: D2PAK, TO-263AB Pkg
标准包装: 1
系列: QFET™
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 27A
开态Rds(最大)@ Id, Vgs @ 25° C: 70 毫欧 @ 13.5A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 43nC @ 10V
输入电容 (Ciss) @ Vds: 1400pF @ 25V
功率 - 最大: 3.75W
安装类型: 表面贴装
封装/外壳: TO-263-3,D²Pak(2 引线+接片),TO-263AB
供应商设备封装: D²PAK
包装: 标准包装
产品目录页面: 1607 (CN2011-ZH PDF)
其它名称: FQB27P06TMDKR
October 2013
FQB27P06
P-Channel QFET ? MOSFET
-60 V, -27 A, 70 m ?
Description
This P-Channel enhancement mode power MOSFET is
produced using Fairchild Semiconductor’s proprietary planar
stripe and DMOS technology. This advanced MOSFET
technology has been especially tailored to reduce on-state
resistance, and to provide superior switching performance
and high avalanche energy strength. These devices are
suitable for switched mode power supplies, audio amplifier,
DC motor control, and variable switching power applications.
Features
? - 2 7 A, - 6 0 V, R DS(on) = 70 m ? (Max) @V GS = - 10 V,
I D = - 13.5 A
? Low Gate Charge ( Typ. 33 nC)
? Low Crss ( Typ. 12 0 pF)
? 100% Avalanche Tested
? 175 ° C Maximum Junction Temperature Rating
S
D
G
G
S
D 2 -PAK
D
Absolute Maximum Ratings
T C = 25°C unless otherwise noted
Symbol
V DSS
Drain-Source Voltage
Parameter
FQB27P06 TM
-60
Unit
V
I D
Drain Current
- Continuous (T C = 25°C)
- Continuous (T C = 100°C)
-27
-19.1
A
A
I DM
Drain Current
- Pulsed
(Note 1)
-108
A
V GSS
Gate-Source Voltage
± 25
V
E AS
I AR
E AR
dv/dt
P D
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (T A = 25°C) *
Power Dissipation (T C = 25°C)
- Derate above 25°C
(Note 2)
(Note 1)
(Note 1)
(Note 3)
560
-27
12
-7.0
3.75
120
0.8
mJ
A
mJ
V/ns
W
W
W/°C
T J , T STG
T L
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8 " from case for 5 seconds
-55 to +175
300
°C
°C
Thermal Characteristics
Symbol
R ? JC
R ? JA
Parameter
Thermal Resistance, Junction to Case, Max .
Thermal Resistance, Junction to Ambient (minimum pad of 2 oz copper), Max.
Thermal Resistance, Junction to Ambient ( * 1 in 2 pad of 2 oz copper), Max.
FQB27P06 TM
1.25
62.5
40
Unit
o C/W
? 2000 Fairchild Semiconductor Corporation
FQB27P06 Rev. C 1
1
www.fairchildsemi.com
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