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参数资料
| 型号： | FSAM30SM60A |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 5/15页 |
| 文件大小： | 0K |
| 描述： | SMART POWER MODULE 30A SPM32-AA |
| 产品培训模块： | Smart Power |
| 标准包装： | 8 |
| 系列： | SPM™ |
| 类型： | IGBT |
| 配置： | 3 相 |
| 电流： | 30A |
| 电压： | 600V |
| 电压 - 隔离： | 2500Vrms |
| 封装/外壳： | SPM32AA |
| 产品目录页面： | 1222 (CN2011-ZH PDF) |
| 其它名称： | FSAM30SM60A_NL FSAM30SM60A_NL-ND |
Absolute Maximum Ratings (T J = 25°C,
Inverter Part
unless otherwise specified.)
Item
Supply Voltage
Supply Voltage (Surge)
Collector - Emitter Voltage
Each IGBT Collector Current
Each IGBT Collector Current
Each IGBT Collector Current (Peak)
Collector Dissipation
Operating Junction Temperature
Symbol
V DC
V PN(Surge)
V CES
± I C
± I C
± I CP
P C
T J
Condition
Applied to DC-Link
Applied between P and N
T C = 25°C
T C = 100°C
T C = 25°C , Under 1ms Pulse Width
T C = 25°C per Chip
(2nd Note 1)
Rating
450
500
600
30
16
60
62
-20 ~ 125
Unit
V
V
V
A
A
A
W
°C
2nd Notes:
1. It would be recommended that the average junction temperature should be limited to T J ? 125 ? C (at T C ? 100 ? C) in order to guarantee safe operation.
Control Part
Item
Symbol Condition
Rating
Unit
Control Supply Voltage
V CC
Applied between V CC(UH) , V CC(VH) , V CC(WH) -
20
V
COM (H) , V CC(L) - COM (L)
High-Side Control Bias Voltage
V BS
Applied between V B(U) - V S(U) , V B(V) - V S(V) , V B(W) -
20
V
V S(W)
Input Signal Voltage
V IN
Applied between IN (UH) , IN (VH) , IN (WH) - COM (H)
-0.3 ~ V CC +0.3
V
IN (UL) , IN (VL) , IN (WL) - COM (L)
Fault Output Supply Voltage
Fault Output Current
Current-Sensing Input Voltage
V FO
I FO
V SC
Applied between V FO - COM (L)
Sink Current at V FO Pin
Applied between C SC - COM (L)
-0.3 ~ V CC +0.3
5
-0.3 ~ V CC +0.3
V
mA
V
Total System
Item
Self-Protection Supply Voltage Limit
(Short-Circuit Protection Capability)
Symbol Condition
V PN(PROT) Applied to DC-Link,
V CC = V BS = 13.5 ~ 16.5 V
T J = 125°C, Non-Repetitive, < 6 ? s
Rating
400
Unit
V
Module Case Operation Temperature
Storage Temperature
Isolation Voltage
T C
T STG
V ISO
See Figure 2
60Hz, Sinusoidal, AC 1 Minute, Connect
-20 ~ 100
-20 ~ 125
2500
°C
°C
V rms
Pins to Heat Sink Plate
Thermal Resistance
Item
Junction to Case Thermal
Symbol
R th(j-c)Q
Condition
Inverter IGBT Part (per 1/6 module)
Min. Typ.
- -
Max.
2.00
Unit
°C/W
Resistance
Contact Thermal
R th(j-c)F
R th(c-f)
Inverter FWDi Part (per 1/6 module)
Ceramic Substrate (per 1 Module)
-
-
-
-
3.20
0.06
°C/W
°C/W
Resistance
Thermal Grease Applied (2nd Note 3)
2nd Notes:
2. For the measurement point of case temperature(T C ), please refer to Figure 2.
3. The thickness of thermal grease should not be more than 100 ? m.
?2003 Fairchild Semiconductor Corporation
FSAM30SM60A Rev. C8
5
www.fairchildsemi.com
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